IP Library Assignment 048372/0760
Patent Assignment
Reel/Frame 048372/0760

Assignment of Assignor's Interest

Recorded: 2019-02-19 Pages: 13
Assignors
TEYSSEYRE, JEROME
Executed: 2017-10-23
MANATAD, ROMEL
Executed: 2017-09-20
WU, CHUNG-LIN
Executed: 2017-09-20
DOSDOS, BIGILDIS
Executed: 2017-09-20
ALMAGRO, ERWIN IAN
Executed: 2017-09-20
ESTACIO, MARIA CRISTINA
Executed: 2017-09-20
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Vertical and Horizontal Circuit Assemblies
Application: 16/279,336 →
Publication: US 2019/0181083
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 14, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 049473/0932 →
Assignment of Assignor's Interest Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →
Release of Security Interest in Patents Previously Recorded at Reel 049473, Frame 0932 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0721 →