Patent Assignment
Reel/Frame 048388/0557
Assignment of Assignor's Interest
Recorded: 2019-02-20
Pages: 5
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit and Method of Manufacturing the Same