Patent Assignment
Reel/Frame 048399/0908
Assignment of Assignor's Interest
Recorded: 2019-02-21
Pages: 4
Assignors
HUANG, KUAN-YU
Executed: 2019-01-08
HUANG, SUNG-HUI
Executed: 2019-01-08
HSU, SHU-CHIA
Executed: 2019-01-08
CHEN, LEU-JEN
Executed: 2019-01-08
LIU, YI-WEI
Executed: 2019-01-08
HOU, SHANG-YUN
Executed: 2019-01-31
LAI, JUI-HSIEH
Executed: 2019-01-09
CHEN, TSUNG-YU
Executed: 2019-01-18
HUANG, CHIEN-YUAN
Executed: 2019-01-09
CHEN, YU-WEI
Executed: 2019-01-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure