Patent Assignment
Reel/Frame 048416/0881
Assignment of Assignor's Interest
Recorded: 2019-02-22
Pages: 3
Assignors
HUANG, CHUN-JUI
Executed: 2019-02-11
LIN, LI-TE
Executed: 2019-02-11
LIN, PINYEN
Executed: 2019-02-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Etching Process for Forming via Opening in Semiconductor Device Structure