Patent Assignment
Reel/Frame 048418/0781
Assignment of Assignor's Interest
Recorded: 2019-02-24
Pages: 3
Assignors
HISADA, KENICHI
Executed: 2018-10-24
ARAI, KOICHI
Executed: 2018-10-24
MIYAMOTO, HIRONOBU
Executed: 2018-10-24
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device and Semiconductor Device