IP Library › Assignment 048421/0691
Patent Assignment
Reel/Frame 048421/0691

Assignment of Assignor's Interest

Recorded: 2019-02-25 Pages: 3
Assignors
YOSHIDA, TAKU
Executed: 2019-02-06
KURITA, HIDEKI
Executed: 2019-02-04
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property (1)
Semiconductor Wafer, and Method for Polishing Semiconductor Wafer
Application: 16/327,067 →
Publication: US 2019/0189421
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →