Patent Assignment
Reel/Frame 048421/0742
Assignment of Assignor's Interest
Recorded: 2019-02-25
Pages: 5
Assignors
CHEN, CHENG-HUNG
Executed: 2019-01-03
HSU, YU-NU
Executed: 2019-01-03
LIU, CHUN-CHEN
Executed: 2019-01-03
HUANG, HENG-CHI
Executed: 2019-01-10
LI, CHIEN-CHEN
Executed: 2019-01-10
CHEN, SHIH-YEN
Executed: 2019-02-13
HSIEH, CHENG-NAN
Executed: 2019-01-18
LIU, KUO-CHIO
Executed: 2019-01-09
CHEN, CHEN-SHIEN
Executed: 2019-01-09
KU, CHIN-YU
Executed: 2019-01-09
PANG, TE-HSUN
Executed: 2019-01-18
WU, YUAN-FENG
Executed: 2019-02-13
CHIANG, SEN-CHI
Executed: 2019-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with a Barrier Layer and Method for Forming the Same