Patent Assignment
Reel/Frame 048421/0979
Assignment of Assignor's Interest
Recorded: 2019-02-25
Pages: 7
Assignors
INABA, KO
Executed: 2019-02-05
TAKEMASA, TETSU
Executed: 2019-02-05
KOSUGA, TADASHI
Executed: 2019-02-13
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Solder Bonding Method and Solder Joint
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.