Solder bonding method and solder joint
A solder bonding method that bonds, using a solder joint, an electrode of a circuit board to an electrode of an electronic component includes: depositing, on the electrode of the circuit board, an Sn—Bi-based solder alloy with a lower melting point than a solder alloy deposited on the electrode of the electronic component; mounting the electronic component on the circuit board such that the Sn—Bi-based solder alloy contacts the solder alloy on the electrode of the electronic component; heating the circuit board to a peak temperature of heating of 150° C. to 180° C.; holding the peak temperature of heating at a holding time of greater than 60 seconds and less than or equal to 150 seconds; and cooling, after the heating and to form the solder joint, the circuit board at a cooling rate greater than or equal to 3° C./sec.
1. A solder bonding method that bonds, using a solder joint, an electrode of a circuit board to an electrode of an electronic component, the method comprising:
depositing, on the electrode of the circuit board, an Sn—Bi-based solder alloy with a lower melting point than a solder alloy deposited on the electrode of the electronic component;
mounting the electronic component on the circuit board such that the Sn—Bi-based solder alloy contacts the solder alloy on the electrode of the electronic component;
heating the circuit board to a peak temperature of heating of 150° C. to 180° C.;
holding the peak temperature of heating at a holding time of greater than 60 seconds and less than or equal to 150 seconds; and
cooling, after the heating and to form the solder joint, the circuit board at a cooling rate greater than or equal to 3° C./sec, wherein
fine Bi phases in the solder joint each have an area less than or equal to 0.5 μm 2 , coarse Bi phases in the solder joint each have an area of greater than 0.5 μm 2 and less than or equal to 5 μm 2 , and
a proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.
2. The solder bonding method according to claim 1 , wherein, in the solder joint, the peak temperature of heating is lower than a melting point of the solder alloy deposited on the electrode of the electronic component.
3. The solder bonding method according to claim 1 , wherein the Sn—Bi-based solder alloy is at least one of an Sn—Bi solder alloy, an Sn—Bi—Cu solder alloy, an Sn—Bi—Ni solder alloy, an Sn—Bi—Cu—Ni solder alloy, an Sn—Bi—Ag solder alloy, or an Sn—Bi—Sb solder alloy.
4. The solder bonding method according to claim 1 , wherein a Bi content in the Sn—Bi-based solder alloy is 30 to 80 mass %.
5. The solder bonding method according to claim 1 , wherein the solder alloy deposited on the electrode of the electronic component is at least one of an Sn—Cu solder alloy, an Sn—Ag solder alloy, an Sn—Ag—Cu solder alloy, an Sn—Ag—Cu—Ni solder alloy, an Sn—Ag—Cu—Sb solder alloy, or an Sn—Ag—Cu—Ni—Sb solder alloy.
6. The solder bonding method according to claim 1 , wherein a temperature difference between a melting point of the Sn—Bi-based solder alloy and a melting point of a solder alloy deposited on the electrode of the electronic component is greater than or equal to 30° C.
7. The solder bonding method according to claim 1 , wherein the Sn—Bi-based solder alloy contains 58 mass % of Bi and a balance of Sn.