Patent Assignment
Reel/Frame 048437/0176
Assignment of Assignor's Interest
Recorded: 2019-02-26
Pages: 4
Assignors
CHOU, LEI-CHUN
Executed: 2018-11-20
CHEN, CHIH-LIANG
Executed: 2018-11-20
TZENG, JIANN-TYNG
Executed: 2018-11-20
LAI, CHIH-MING
Executed: 2018-11-30
LIU, RU-GUN
Executed: 2018-11-30
YOUNG, CHARLES CHEW-YUEN
Executed: 2018-11-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Buried Metal for FinFET Device and Method