Patent Assignment
Reel/Frame 048440/0166
Assignment of Assignor's Interest
Recorded: 2019-02-26
Pages: 3
Assignors
SHIN, SEUNG WAN
Executed: 2019-01-31
JUNG, HO JUN
Executed: 2019-01-31
OH, SEUNG CHUL
Executed: 2019-01-31
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.