IP Library Assignment 048456/0130
Patent Assignment
Reel/Frame 048456/0130

Assignment of Assignor's Interest

Recorded: 2019-02-27 Pages: 5
Assignors
PARK, SEONG CHAN
Executed: 2019-02-11
KWON, SANG HYUN
Executed: 2019-02-11
KIM, HAN
Executed: 2019-02-11
KIM, HYE LEE
Executed: 2019-02-11
KANG, SEUNG ON
Executed: 2019-02-11
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 16/282,642 →
Publication: US 2020/0083137
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →