Patent Assignment
Reel/Frame 048479/0885
Assignment of Assignor's Interest
Recorded: 2019-03-01
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2019-02-18
SU, AN-JHIH
Executed: 2019-02-18
CHEN, WEI-YU
Executed: 2019-02-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Photonic Integrated Package and Method Forming Same