Patent Assignment
Reel/Frame 048482/0617
Assignment of Assignor's Interest
Recorded: 2019-03-01
Pages: 3
Assignors
PIETAMBARAM, SRINIVAS
Executed: 2019-02-28
MANEPALLI, RAHUL
Executed: 2019-02-28
DUAN, GANG
Executed: 2019-02-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Hybrid Fan-Out Architecture with Emib and Glass Core for Heterogeneous Die Integration Applications