Patent Assignment
Reel/Frame 048490/0806
Assignment of Assignor's Interest
Recorded: 2019-03-04
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Mounted Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.