Patent Assignment
Reel/Frame 048497/0721
Assignment of Assignor's Interest
Recorded: 2019-03-05
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2019-02-20
LU, CHUN-LIN
Executed: 2019-02-20
PU, HAN-PING
Executed: 2019-02-20
WU, KAI-CHIANG
Executed: 2019-02-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure with Reinforcement Structures in a Redistribution Circuit Structure and Method of Manufacturing the Same