Patent Assignment
Reel/Frame 048497/0738
Assignment of Assignor's Interest
Recorded: 2019-03-05
Pages: 4
Assignors
HWANG, CHIEN-LING
Executed: 2019-02-20
HSIEH, CHING-HUA
Executed: 2019-02-20
LIAO, HSIN-HUNG
Executed: 2019-02-20
WU, SUNG-YUEH
Executed: 2019-02-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Mutli-Chip Package with Encapsulated Conductor Via