Patent Assignment
Reel/Frame 048508/0333
Assignment of Assignor's Interest
Recorded: 2019-03-05
Pages: 2
Assignor
DADVAND, NAZILA
Executed: 2019-02-13
Assignee
TEXAS INSTRUMENTS INCORPORATED
P O BOX 655474, MS 3999, DALLAS, TEXAS, 75265
Covered Property
(1)
Semiconductor Device with Vias Having a Zinc-Second Metal-Copper Composite Layer