IP Library Assignment 048508/0782
Patent Assignment
Reel/Frame 048508/0782

Assignment of Assignor's Interest

Recorded: 2019-03-05 Pages: 4
Assignors
TRUHITTE, DARRELL D.
Executed: 2014-07-23
LETTERMAN, JAMES P., JR.
Executed: 2014-07-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Wafer Level Flat No-Lead Semiconductor Packages and Methods of Manufacture
Application: 16/293,201 →
Publication: US 2019/0198376
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 14, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 049473/0932 →
Release of Security Interest in Patents Previously Recorded at Reel 049473, Frame 0932 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0721 →