Patent Assignment
Reel/Frame 048521/0723
Assignment of Assignor's Interest
Recorded: 2019-03-06
Pages: 4
Assignors
AKIBA, SHOTA
Executed: 2019-02-12
TSUJI, KENICHI
Executed: 2019-02-12
YAMADA, KUNIHIRO
Executed: 2019-02-12
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Thermal Conductive Silicone Composition, Semiconductor Device, and Method for Manufacturing Semiconductor Device