Patent Assignment
Reel/Frame 048524/0826
Assignment of Assignor's Interest
Recorded: 2019-03-07
Pages: 5
Assignors
CHEN, PENG
Executed: 2019-01-15
ZHOU, HOUDE
Executed: 2019-01-15
ZHANG, BAOHUA
Executed: 2019-01-15
GU, CHAO
Executed: 2019-01-15
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
ROOM 7018, NO.18, HUAGUANG BOULEVARD, GUANDONG TECH. INDUSTRIAL PARK, DONGHU DEVELOPMENT AREA, HONGSHAN DISTRICT, WUHAN CITY, HUBEI PROVINCE, CHINA
Covered Property
(1)
Integrated Circuit Packaging Structure and Manufacturing Method Thereof
Application:
16/294,951 →
Publication:
US 2020/0235023