Patent Assignment
Reel/Frame 048531/0505
Assignment of Assignor's Interest
Recorded: 2019-03-07
Pages: 3
Assignor
YOSHIZAWA, DAISUKE
Executed: 2019-02-19
Assignees
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
3-1-1 KYOBASHI, CHUO-KU, TOKYO, 104-0031, JAPAN
TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
72-34, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, KANAGAWA, 212-0013, JAPAN
Covered Property
(1)
Pressure Contact Type Semiconductor Device Stack
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 19, 2017
From: OMOTE, KENICHIRO; NAKAJIMA, RYO; MUKUNOKI, MAKOTO; YOSHIZAWA, DAISUKE
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 044430/0349 →
Assignment of Assignor's Interest
Apr 5, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
Reel/Frame 045443/0179 →
Change of Name
Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →