Pressure contact type semiconductor device stack
To provide a pressure contact type semiconductor device stack which can uniformly pressurize pressure contact type semiconductor devices irrespective of presence or absence of a notch portion of the pressure contact type semiconductor device, and can prevent thermal destruction of the relevant pressure contact type semiconductor device. A pressurizing device for pressurizing between pressure contact type semiconductor devices and heat sinks which have been stacked is provided with pressuring bodies arranged at the upper and lower surfaces, metal fittings for insulating plate each for distributing a pressure applied by the pressuring body to an outer circumferential surface, and insulating plates each for pressuring the relevant heat sinks by the pressure applied to a pressurizing surface of the relevant metal fitting for insulating plate, the pressure contact type semiconductor device has a notch portion at a part of a peripheral portion of a post surface of any one of a collector post surface or an emitter post surface, and a device for making a distance from a pressurizing surface of the metal fitting for insulating plate pressurized by the upper surface pressurizing body to a front surface of a chip equal to a distance from a pressurizing surface of the metal fitting for insulating plate pressurized by the lower surface pressurizing body to a back surface of a chip is provided.
1. A pressure contact type semiconductor device stack comprising:
a plurality of pressure contact type semiconductor devices each composed of a multi-chip semiconductor device in which a plurality of chips are arranged on a same plane;
a plurality of heat sinks arranged such that the plurality of pressure contact type semiconductor devices and the plurality of heat sinks are alternately stacked where a first heat sink of the plurality of heat sinks is arranged on a first surface of a pressure contact type semiconductor device of the plurality of pressure contact type semiconductor devices and a second heat sink of the plurality of heat sinks is arranged on a second surface of the pressure contact type semiconductor device;
a pressurizing device for pressurizing the plurality of pressure contact type semiconductor devices and the plurality of heat sinks so that a pressure contact force between the pressure contact type semiconductor device and the first heat sink becomes a prescribed pressure contact force, wherein
the pressurizing device includes:
a plurality of pressurizing bodies including
a first pressurizing body arranged on an upper surface of the plurality of pressure contact type semiconductor devices and the plurality of heat sinks, and
a second pressurizing body arranged on a lower surface of the plurality of pressure contact type semiconductor devices and the plurality of heat sinks,
a plurality of metal fittings each distributing a pressure applied by one of the plurality of pressurizing bodies to an outer circumferential surface, and
a plurality of insulating plates, each of which is arranged between a pressurizing surface of one of the plurality of metal fittings and a heat sink of the plurality of heat sinks that is arranged nearest to the pressurizing surface of the one of the plurality of metal fittings and pressurizes the heat sink by a pressure applied to the pressuring surface of the one of the plurality of metal fittings;
the pressure contact type semiconductor device includes:
a collector post surface at one side of the pressure contact type semiconductor device that is a pressure contact surface,
an emitter post surface at a side of the pressure contact type semiconductor device arranged opposite to the collector post surface,
a first notch portion at a part of a peripheral portion of a post surface of any one of the collector post surface or the emitter post surface, and
a group of chips, of the plurality of chips, arranged between the collector post surface and the emitter post surface in parallel with the pressure contact surface, and arranged so that a distance from the collector post surface to a front surface of a chip of the group of chips and a distance from the emitter post surface to a back surface of the chip are different; and
a device for making a first distance, from the pressurizing surface of the metal fitting pressurized by the first pressurizing body to a front surface of a chip of a pressure contact type semiconductor device of the plurality of pressure contact type semiconductor devices arranged nearest to the pressurizing surface of the metal fitting pressurized by the first pressurizing body, equal to a second distance from the pressurizing surface of the metal fitting pressurized by the second pressurizing body to a back surface of a chip of a pressure contact type semiconductor device of the plurality of pressure contact type semiconductor devices arranged nearest to the pressurizing surface of the metal fitting pressurized by the second pressurizing body.
2. The pressure contact type semiconductor device stack according to claim 1 , wherein:
the device includes a spacer which is arranged
between the insulating plate arranged between the pressurizing surface of the metal fitting pressurized by the first pressurizing body and the heat sink arranged nearest to the pressurizing surface of the metal fitting pressurized by the first pressurizing body when the first distance is shorter than the second distance in a case where the spacer is not provided, or
between the pressurizing surface of the metal fitting pressurized by the second pressurizing body and the heat sink arranged nearest to the pressurizing surface of the metal fitting pressurized by the second pressurizing body when the second distance is shorter than the first distance in the case where the spacer is not provided, and
the spacer has a thickness that is equal to a difference between the first distance and the second distance in the case when the spacer is not provided.
3. The pressure contact type semiconductor device stack according to claim 2 , wherein:
each of the plurality of pressurizing bodies includes a spherical pressurizing body or a conical pressurizing body.
4. The pressure contact type semiconductor device stack according to claim 2 , wherein:
each of the plurality of metal fittings includes
a second notch portion which is subjected to counter boring at a pressure contact surface side, and
a surface which is bored so as to contact with a spherical pressurizing body at a contacting portion when the plurality of pressurizing bodies include the spherical pressurizing body, or a surface which is bored so as to contact with a conical pressuring body at a contacting portion when the plurality of pressurizing bodies include the conical pressurizing body, at a surface of a side opposite to the second notch portion.
5. The pressure contact type semiconductor device stack according to claim 1 , wherein:
the device varies a thickness of the heat sink arranged nearest to the pressurizing surface of the metal fitting pressurized by the first pressurizing body when the first distance is shorter than the second distance in a case where a spacer is not provided to thereby absorb a difference between the first distance the second distance in the case where the spacer is not provided, or
varies a thickness of the heat sink arranged nearest to the pressurizing surface of the metal fitting pressurized by the second pressurizing body when the second distance is shorter than the first distance in the case where the spacer is not provided to thereby absorb the difference between the first distance and the second distance in the case where the spacer is not provided.
6. The pressure contact type semiconductor device stack according to claim 5 , wherein:
the first heat sink is composed of a water-cooled heat sink.
7. The pressure contact type semiconductor device stack according to claim 5 , wherein:
each of the plurality of pressurizing bodies includes a spherical pressurizing body or a conical pressurizing body.
8. The pressure contact type semiconductor device stack according to claim 5 , wherein:
each of the plurality of metal fittings includes
a second notch portion which is subjected to counter boring at a pressure contact surface side, and
a surface which is bored so as to contact with a spherical pressurizing body at a contacting portion when the plurality of pressurizing bodies include the spherical pressurizing body, or a surface which is bored so as to contact with a conical pressuring body at a contacting portion when the plurality of pressurizing bodies include the conical pressurizing body, at a surface of a side opposite to the second notch portion.
9. The pressure contact type semiconductor device stack according to claim 1 , wherein:
the device varies a thickness of the insulating plate arranged between the pressurizing surface of the metal fitting pressurized by the first pressurizing body and the heat sink arranged nearest to the pressurizing surface of the metal fitting pressurized by the first pressurizing body to thereby absorb a difference between the first distance and the second distance in a case where a spacer is not provided, or
varies a thickness of the insulating plate arranged between the pressurizing surface of the metal fitting pressurized by the second pressurizing body and the heat sink arranged nearest to the pressurizing surface of the metal fitting pressurized by the second pressurizing body to thereby absorb the difference between the first distance and the second distance in the case where the spacer is not provided.
10. The pressure contact type semiconductor device stack according to claim 9 , wherein:
each of the plurality of pressurizing bodies includes a spherical pressurizing body or a conical pressurizing body.
11. The pressure contact type semiconductor device stack according to claim 9 , wherein:
each of the plurality of metal fittings includes
a second notch portion which is subjected to counter boring at a pressure contact surface side, and
a surface which is bored so as to contact with a spherical pressurizing body at a contacting portion when the plurality of pressurizing bodies include the spherical pressurizing body, or a surface which is bored so as to contact with a conical pressuring body at a contacting portion when the plurality of pressurizing bodies include the conical pressurizing body, at a surface of a side opposite to the second notch portion.
12. The pressure contact type semiconductor device stack according to claim 1 , wherein:
the first heat sink is composed of a water-cooled heat sink.
13. The pressure contact type semiconductor device stack according to claim 1 , wherein:
each of the plurality of pressurizing bodies includes a spherical pressurizing body or a conical pressurizing body.
14. The pressure contact type semiconductor device stack according to claim 1 , wherein:
each of the plurality of metal fittings includes
a second notch portion which is subjected to counter boring at a pressure contact surface side, and
a surface which is bored so as to contact with a spherical pressurizing body at a contacting portion when the plurality of pressurizing bodies include the spherical pressurizing body, or a surface which is bored so as to contact with a conical pressuring body at a contacting portion when the plurality of pressurizing bodies include the conical pressurizing body, at a surface of a side opposite to the second notch portion.