Patent Assignment
Reel/Frame 048537/0672
Assignment of Assignor's Interest
Recorded: 2019-03-08
Pages: 5
Assignors
JENG, SHIN-PUU
Executed: 2018-01-04
LIU, HSIEN-WEN
Executed: 2018-01-04
CHUANG, PO-YAO
Executed: 2018-01-04
FANG, TZU-JUI
Executed: 2018-01-04
LIN, YI-JOU
Executed: 2019-02-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Fan-Out Package Structure and Method for Forming the Same