Assignment of Assignor's Interest

Recorded: 2019-03-11 Pages: 3

Assignor

MIZUTANI, DAISUKE

Executed: 2019-02-22

Assignee

FUJITSU LIMITED

1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN

Covered Property (1)

Wiring Substrate, Semiconductor Module, and Manufacturing Method for Wiring Substrate

Application: 16/297,962 →

Publication: US 2019/0287893

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.