Patent Assignment
Reel/Frame 048559/0114
Assignment of Assignor's Interest
Recorded: 2019-03-11
Pages: 7
Assignors
HATAZAKI, AKITSUGU
Executed: 2019-02-28
TAHARA, HIROKO
Executed: 2019-02-28
FUKUMAKI, NAOMI
Executed: 2019-02-28
KITAMURA, MASAYUKI
Executed: 2019-03-05
OHASHI, TAKASHI
Executed: 2019-03-07
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property
(1)
Semiconductor Device Having a Stack Body Including Metal Films and First Insulating Films Alternately Stacked on a Semiconductor Substrate and Including a Stepped End Portion and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.