Patent Assignment
Reel/Frame 048575/0142
Assignment of Assignor's Interest
Recorded: 2019-03-12
Pages: 4
Assignors
LIN, HAN-YU
Executed: 2019-02-22
YANG, CHANSYUN DAVID
Executed: 2019-02-22
LEE, FANG-WEI
Executed: 2019-02-22
LIN, TZE-CHUNG
Executed: 2019-02-22
LIN, LI-TE
Executed: 2019-02-22
LIN, PINYEN
Executed: 2019-02-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device Structure with Inner Spacer Layer