Patent Assignment
Reel/Frame 048582/0134
Assignment of Assignor's Interest
Recorded: 2019-03-13
Pages: 6
Assignors
KIM, JONGYOUN
Executed: 2019-01-15
LEE, SEOKHYUN
Executed: 2019-01-15
BAE, MINJUN
Executed: 2019-01-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Redistribution Substrate, Method of Fabricating the Same, and Semiconductor Package Including the Same