Patent Assignment
Reel/Frame 048582/0386
Assignment of Assignor's Interest
Recorded: 2019-03-13
Pages: 11
Assignors
SIKKA, KAMAL K.
Executed: 2019-03-02
LIE, FEE LI
Executed: 2019-03-08
WINSTEL, KEVIN
Executed: 2019-02-28
BONAM, RAVI K.
Executed: 2019-03-08
SARAF, IQBAL RASHID
Executed: 2019-03-11
GOLDFARB, DARIO
Executed: 2019-03-04
CORLISS, DANIEL
Executed: 2019-02-28
GUPTA, DINESH
Executed: 2019-03-06
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Three-Dimensional Microelectronic Package with Embedded Cooling Channels