IP Library Assignment 048584/0487
Patent Assignment
Reel/Frame 048584/0487

Assignment of Assignor's Interest

Recorded: 2019-03-13 Pages: 22
Assignors
SINGER, FRANK
Executed: 2019-03-02
MOOSBURGER, JÜRGEN
Executed: 2019-02-06
SCHWARZ, THOMAS
Executed: 2019-02-07
HOEPPEL, LUTZ, DR.
Executed: 2019-02-06
SABATHIL, MATTHIAS, DR.
Executed: 2019-02-07
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
LEIBNIZSTRASSE 4, REGENSBURG, 93055, GERMANY
Covered Property (1)
Multi-Chip Module with Light-Emitting Diode (LED) Chips Configured for Surface Mount Technology (SMT)
Application: 16/322,069 →
Publication: US 2019/0189598
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →