Patent Assignment
Reel/Frame 051464/0504
Assignment of Assignor's Interest
Recorded: 2020-01-03
Pages: 25
Assignor
OSRAM OPTO SEMICONDUCTORS GMBH
Executed: 2019-12-18
Assignee
OSRAM OLED GMBH
WERNERWERKSTRASSE 2, REGENSBURG, 93049, GERMANY
Covered Properties
(431)
Light Source with Led Chip and Luminophore Layer
Housing for an Optical Component, Assembly, Method for Producing a Housing and Method for Producing an Assembly
Application:
14/426,072 →
Publication:
US 2015/0228873
Optoelectronic Semiconductor Chip and Method for the Production Thereof
Optoelectronic Component Having a Housing with a Plurality of Openings
Optoelectronic Component, Optoelectronic Arrangement, Method of Producing an Optical Element, and Method of Producing an Optoelectronic Component
Production of Optoelectronic Components
Method for Classifying Light-Emitting Semiconductor Components and Image Sensor Application Having an Image Sensor and a Semiconductor Element
A Lighting Device Having an Optical Lens Formed on a Composite Encapsulant Having Nanoparticles Covering a Light Source
Application:
15/154,576 →
Publication:
US 2017/0331016
Optoelectronic Component with Protective Circuit
Semiconductor Component and Illumination Device
Method for Lateral Patterning of a Pattern Layer with Three-Dimensional Pattern Elements, and Semiconductor Device
Method of Producing an Optoelectronic Component and Optoelectronic Component
Application:
15/313,303 →
Publication:
US 2017/0194536
Optoelectronic Device with Silicon Slice Cover Arranged Downstream of a Conversion Element
Optoelectronic Semiconductor Device Package with Conversion Layer and Method for Producing the Same
Surface-Mountable Semiconductor Component and Method for Producing Same
Application:
15/318,660 →
Publication:
US 2017/0148966
Backlighting Device
Method of Producing Optoelectronic Component with Integrated Protection Diode
Housing for an Optical Component, Assembly, Method for Producing a Housing and Method for Producing an Assembly
Application:
15/487,277 →
Publication:
US 2017/0222092
Wavelength Converters with Improved Thermal Conductivity and Lighting Devices Including the Same
Optoelectronic Arrangement Having a Semiconductor Chip and a Conversion Element
Optoelectronic Semiconductor Chip and Method of Producing the Same
Vehicle Headlamp Lighting Assembly Comprising a Shutter That Consists of a Plurality of Apertures
Application:
15/518,019 →
Publication:
US 2017/0307177
Optoelectronic Semiconductor Device and Apparatus with an Optoelectronic Semiconductor Device
Method of Applying a Material to a Surface
Application:
15/524,036 →
Publication:
US 2017/0317245
Pulse Oximetry Device and Method of Operating a Pulse Oximetry Device
Conversion Element and Production Method Thereof
Application:
15/527,320 →
Publication:
US 2017/0345977
Method of Producing an Optoelectronic Semiconductor Chip and Optoelectronic Semiconductor Chip
Optoelectronic Component Having a Layer with Lateral Offset Inclined Side Surfaces
Optoelectronic Semiconductor Component and Method for Fabricating an Optoelectronic Semiconductor Component
Optoelectronic Semiconductor Device Having a Side Face as Mounting Side
Optoelectronic Arrangement having a Radiation Conversion Element and Method for Producing a Radiation Conversion Element
Method for Producing a Plurality of Semiconductor Chips and Semiconductor Chip
Device for Converting the Wavelength of Electromagnetic Radiation
Optoelectronic Semiconductor Device and Method for Producing an Optoelectronic Semiconductor Device
Method for Producing a Semiconductor Body
Method for Structuring a Nitride Layer, Structured Dielectric Layer, Optoelectronic Component, Etching Method for Etching Layers, and an Environment Sensor
Radiation Body and Method for Producing a Radiation Body
Application:
15/552,470 →
Publication:
US 2018/0047873
Sensor Device
Sensor for Sensing a Biometric Function
Application:
15/560,693 →
Publication:
US 2018/0103857
Optoelectronic Semiconductor Body and Method for Producing an Optoelectronic Semiconductor Body
Optoelectronic Component with Reflecting Film on Molded Body and Method of Production Thereof
Application:
15/564,499 →
Publication:
US 2018/0076367
Light-Emitting Component and Method of Producing a Light-Emitting Component
Optoelectronic Lamp Device
Application:
15/566,575 →
Publication:
US 2018/0097335
Method of Producing a Converter Component
Application:
15/571,084 →
Publication:
US 2018/0166614
Phosphor
Method of Making a Single Crystal Wavelength Conversion Element, Single Crystal Wavelength Conversion Element, and Light Source Containing Same
Lens and Optoelectronic Lighting Device
Method of Producing Optoelectronic Components and Surface-Mounted Optoelectronic Component
Light Source Comprising a Number of Semi-Conductor Components
Method for Producing an Electronic Component with a Carrier Element and Electronic Component with a Carrier Element
Application:
15/576,043 →
Publication:
US 2018/0159009
Method for Producing a Nitride Semiconductor Component, and a Nitride Semiconductor Component
Light-Emitting Semiconductor Chip and Method for Producing a Semiconductor Light-Emitting Chip
Semiconductor Laser Diode
Application:
15/649,437 →
Publication:
US 2017/0310081
Light-Emitting Diode Arrangement
Light-Emitting Component
Optically Effective Element, Method of Producing an Optically Effective Element, and Optoelectronic Component
Measuring System, Use of at Least One Individually Operable Led Lighting Unit as a Sender Unit in a Measuring System, Method for Operating a Measuring System and Lighting Source Having a Measuring System
Application:
15/706,581 →
Publication:
US 2018/0088215
Optoelectronic Component with a First Potting Material Covering Parts of a First Optoelectronic Semiconductor Chip and a Second Potting Material Covering the First Potting Material
Component and Method of Producing a Component
Method for Producing an Optoelectronic Semiconductor Device and Optoelectronic Semiconductor Device
Arrangement
Light-Emitting Diode and Method of Producing a Light-Emitting Diode
Phosphor, Method for Producing a Phosphor and Use of a Phosphor
Optoelectronic Semiconductor Component
Optoelectronic Semiconductor Chip
Component and Method of Producing Components
Composite Material with Photoluminescent Material Embedded in a Transparent Matrix
Optoelectronic Semiconductor Chip
Application:
15/742,871 →
Publication:
US 2018/0212107
Optoelectronic Arrangement and Method for Producing an Optoelectronic Arrangement
Method of Producing an Apparatus, Apparatus and Optoelectronic Component
Method for Producing a Plurality of Semiconductor Chips Having Recesses in the Device Layer
Semiconductor Element and Method for Production Thereof
Component Having a Metal Carrier and Method for Producing Components
Housing Comprising a Semiconductor Body and a Method for Producing a Housing with a Semiconductor Body
Method for Producing a Component, and a Component
Method of Manufacturing an Optoelectronic Component, and Optoelectronic Component
Application:
15/749,656 →
Publication:
US 2018/0226518
Electronic Device
Optoelectronic Semiconductor Chip
Carrier Substrate for an Optoelectronic Semiconductor Component
Laser Component and Method of Producing Same
Optoelectronic Component, Method for Manufacturing an Optoelectronic Component and Method for Operating an Optoelectronic Component
Carrier for a Component, Component and Method for Producing a Carrier or a Component
Optoelectronic Semiconductor Chip and Method for Producing Same
Optoelectronic Component and Method of Producing an Optoelectronic Component
Application:
15/756,651 →
Publication:
US 2018/0254385
Method of Producing an Optoelectronic Semiconductor Component, Optoelectronic Semiconductor Component, and Temporary Carrier
Optoelectronic Semiconductor Component and 3D Printer
Light-Emitting Component and Method for Producing a Light-Emitting Component
Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component
Housing Having a Recess Exterior for an Optoelectronic Component
Semiconductor Component Comprising a First and a Second Shaped Body and Method for Producing a Semiconductor Component Comprising a First and a Second Shaped Body
Method of Forming One or More Three-Dimensional Objects
Method for Producing an Optoelectronic Device
Semiconductor Laser
Method of Producing an Optoelectronic Component
Stable Red Ceramic Phosphors and Technologies Including the Same
Optoelectronic Component
Optoelectronic Component
Application:
15/764,938 →
Publication:
US 2018/0287018
Method for Producing a Semiconductor Chip and Semiconductor Chip
Semiconductor Laser and Semiconductor Laser Arrangement
Optoelectronic Component Having a Lead Frame with a Stiffening Structure
Semiconductor Laser and Method for Producing a Semiconductor Laser
Optoelectronic Arrangement
Optoelectronic Component and Background Lighting for a Display
Optoelectronic Component with Esd Protection
Optoelectronic Component and Method of Producing Same
Semiconductor Laser and Method of Producing a Semiconductor Laser and Wafer
Application:
15/773,592 →
Publication:
US 2018/0323573
Assembly Including a Carrier Having a Glass Material and an Optoelectronic Semiconductor Component
Radiation-Emitting Semiconductor Chip, Optoelectronic Component Comprising a Radiation-Emitting Semiconductor Chip, and Method of Coating a Radiation-Emitting Semiconductor Chip
Module for a Video Wall
Package for an Electronic Component, Electronic Component and Electronic Arrangement
Method for Manufacturing an Optoelectronic Component, and Optoelectronic Component
Light-Emitting Diode Chip, and Method for Manufacturing a Light-Emitting Diode Chip
Light Emitting Diode Chip with a Reflective Layer Sequence
Device Including at Least One Optoelectronic Semiconductor Component
Method for Producing a Plurality of Components, and Component
Method of Producing an Optoelectronic Component, and Optoelectronic Component
Optoelectronic Semiconductor Component
Method for the Ultrasonic Microscopic Measurement of Semiconductor Samples, Computer Program for the Ultrasonic Microscopic Measurement of Semiconductor Samples, Computer Program Product and Ultrasound Microscope
Component with End-Side Mounted Light Emitting Semiconductor Chip
Method for Producing a Light-Emitting Diode Display and Light-Emitting Diode Display
Method for Producing a Coating and Optoelectronic Semiconductor Component Having a Coating
Electronic Component, Optoelectronic Component, Component Arrangement, and Method for Producing an Electronic Component
Laserdiode
Semiconductor Component and Method of Producing a Semiconductor Component
Application:
15/902,282 →
Publication:
US 2018/0249578
Method for Operating a Light Source for a Camera, Light Source, Camera
Production of radiation-emitting components
Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component
Apparatus for Presenting an Image
Method for Producing an Optic Device, Optic Device and Assembly Comprising Such an Optic Device
Method of Producing an Optoelectronic Device with a Frame Projecting with Circular Receptacle Section Beyond a First Side of a Lens
Optoelectronic Component and Method of Producing an Optoelectronic Component
Method for Producing an Optoelectronic Semiconductor Component, and Optoelectronic Semiconductor Component
Method for Assembling a Carrier with Components, Pigment for Assembling a Carrier with a Component and Method for Producing a Pigment
Display Device
Method of Producing a Plurality of Conversion Elements and Optoelectronic Component
Optoelectronic Component and Method for the Production Thereof
Method of Producing a Plurality of Laser Diodes and Laser Diode
Electronic Component and Method for Producing an Electronic Component
Component Having Boundary Element
Light-Emitting Semiconductor Chip and Optoelectronic Component
Light-Emitting Assembly and Method for Producing a Light-Emitting Assembly
Carrier for an Optoelectronic Component, Method of Producing a Carrier for an Optoelectronic Component, Wafer and Soldering Method
Method of Producing an Optoelectronic Component, and Optoelectronic Component
Heat Transmissive Optoelectronic Component and Module
Optoelectronic Lighting Apparatus and Display Device
Method of Producing a Radiation-Emitting Semiconductor Chip and Radiation-Emitting Semiconductor Chip
Method for Producing a Plurality of Components
Method of Operating a Semiconductor Light Source, and Semiconductor Light Source
Method of Producing an Optoelectronic Lighting Device and Optoelectronic Lighting Device
Optoelectronic Semiconductor Component
Optoelectronic Semiconductor Chip and Method for Manufacturing an Optoelectronic Semiconductor Chip
Conversion Element and Radiation-Emitting Semiconductor Device Comprising a Conversion Element of Said Type
Production of a Multi-Chip Component
Lighting Device
Optoelectronic Component Having Side Contacts
Method of Producing an Optoelectronic Lighting Device and Optoelectronic Lighting Device
Semiconductor Light Source
Semiconductor Component and Method for Producing a Semiconductor Component
Application:
16/078,561 →
Publication:
US 2019/0051802
Semiconductor Chip, Method of Producing a Semiconductor Chip and Apparatus Having a Plurality of Semiconductor Chips
Method for Producing Luminescent Particles with a Protective Layer and Luminescent Particles Having a Protective Layer
Video Wall Module and Method of Producing a Video Wall Module
Optoelectronic Component and Method for Producing an Optoelectronic Component
Laser Bars Having Trenches
Optoelectronic Component with a Lead Frame Section
Pixel Light Source
Light-Emitting Semiconductor Chip and Method for Producing a Light-Emitting Semiconductor Chip
Optoelectronic Semiconductor Chip
Optoelectronic Component and Method for Producing an Optoelectronic Component
Optoelectronic Lighting Device, Carrier for an Optoelectronic Semiconductor Chip, and Optoelectronic Lighting System
Optoelectronic Component, Method for Producing an Optoelectronic Component and Flashlight for a Portable Device
Optoelectronic Lighting Device, Method of Illuminating a Scene, Camera and Mobile Terminal
Method and Optoelectronic Lighting Device for Lighting a Face of a Person, Camera, and Mobile Terminal
Projection Optical Unit, Optoelectronic Semiconductor Chip, Optoelectronic Illumination System, Camera, Terminal
Method for Producing an Optoelectronic Semiconductor Chip and Optoelectronic Semiconductor Chip
Diffractive Optical Element, Method of Producing a Diffractive Optical Element and Laser Component
Filament, Method of Producing a Filament and a Light Source Including a Filament
Light-Emitting Module and Display Device Comprising Same
Method for Producing an Electronic Device and Electronic Device
Filament with Light-Emitting Semiconductor Chips, Lighting Means and Method of Producing a Filament
Converter for Partial Conversion of a Primary Radiation and Light-Emitting Device
Application:
16/090,566 →
Publication:
US 2019/0181302
Method of Producing Optoelectronic Semiconductor Components and Optoelectronic Semiconductor Component
Light-Emitting Semiconductor Chip, Light-Emitting Component and Method for Producing a Light-Emitting Component
Light-Emitting Semiconductor Chip, Light-Emitting Component and Method for Producing a Light-Emitting Component
Semiconductor Laser
Optoelectronic Component and Method of Producing an Optoelectronic Component
Component Having a Reflector and Method of Producing Components
Light-Emitting Component
Optoelectronic Semiconductor Chip
Edge-Emitting Semiconductor Laser
Optoelectronic Semiconductor Chip and Method of Producing an Optoelectronic Semiconductor Chip
Method for Producing an Optoelectronic Component, and Optoelectronic Component
Laser Module with an Optical Component
Application:
16/095,426 →
Publication:
US 2019/0131766
Optoelectronic Component and Method of Producing an Optoelectronic Component
Method for Producing an Optoelectronic Component and Optoelectronic Component
Module for a Video Wall with Retaining Pins
Lens and Flash
Optical Assembly and Display Device Comprising an Arrangement of Luminescence Diode Chips
Laser Assembly and Operating Method
Semiconductor Laser Diode
Laser Component, Use of a Laser Component, Device Having Laser Component and Method of Producing Laser Components
Mounting Structure for a Light Guide, Housing with a Mounting Structure, Optoelectronic Device and Method of Producing an Optoelectronic Device
3D Display Element, 3D Display System, Method of Operating a 3D Display Element and Method of Operating a 3D Display System
Optoelectronic Semiconductor Chip
Application:
16/155,634 →
Publication:
US 2019/0044031
Method for Producing a Laser Diode Bar and Laser Diode Bar
Light-Emitting Device with a Sealed Interior Space
Application:
16/177,685 →
Publication:
US 2019/0140145
Optoelectronic Semiconductor Chip and Method for Producing an Optoelectronic Semiconductor Chip
Display Device and Method for Producing a Display Device
Method of Producing a Lighting Device
Optoelectronic Component and Method of Producing an Optoelectronic Component
Optoelectronic Semiconductor Chip
Led Filament Comprising Conversion Layer
Lighting Device
Phosphor and Method for Producing the Phosphor
Phosphor and Method for Producing the Phosphor
Lighting Device
Method of Producing Optoelectronic Components and Optoelectronic Component
Radiation-Emitting Semiconductor Chip with Overlapping Contact Layers
Edge-emitting Semiconductor Laser and Method for Operating a Semiconductor Laser
Device for Slurrying a Suspension and Method for Operating a Device
Display Device with different size Subpixels and Operating Method for such a Display Device
Optoelectronic Device with a Protective Layer Comprising an Anchor Group and a Head Group
Application:
16/221,872 →
Publication:
US 2019/0189855
Optoelectronic Component Having a Potting Body with a Filler
Application:
16/223,931 →
Publication:
US 2019/0207070
Optoelectronic Semiconductor Device
Method of Embedding Opto-Electronic Components in a Layer
Device with Semiconductor Chips on a Primary Carrier
Semiconductor Chip Having a Mask Layer with Openings
Method for Producing Optoelectronic Semiconductor Devices and Optoelectronic Semiconductor Device
Epitaxial Conversion Element, Method for Producing an Epitaxial Conversion Element, Radiation Emitting Rgb Unit and Method for Producing a Radiation Emitting Rgb Unit
Optoelectronic Semiconductor Chip and Method of Producing an Optoelectronic Semiconductor Chip
Optoelectronic Component
Radiation Emitting Device
Optoelectronic Device and Method
Optoelectronic Component, Optoelectronic Device, Flashlight and Headlight
Display Device
Optoelectronic Component and Method of Producing an Optoelectronic Component
Optoelectronic Component with Organic and Inorganic Phosphors and Lighting Apparatus
Radiation-Emitting Component
Module for a Video Wall Having a Film
Application:
16/301,012 →
Publication:
US 2019/0180654
Assembly Comprising an Electric Component
Method for Manufacturing an Optoelectronic Component and Optoelectronic Component
Lighting Device
Phosphor and Method for Producing the Phosphor
Lens and Lamp Having a Lens
Component Having Enhanced Efficiency and Method for Production Thereof
Sensor Device
Filament and Lighting Device
Method of Producing a Radiation-Emitting Component and Radiation-Emitting Component
Method of Producing a Laser Diode Bar and Laser Diode Bar
Component for Detecting UV Radiation and Method for Producing a Component
Optoelectronic Semiconductor Component
Semiconductor Laser Diode
Method for Producing Optoelectronic Semiconductor Components and Optoelectronic Modules, and Optoelectronic Semiconductor Component and Optoelectronic Module
Semiconductor Layer Sequence
Luminescence Diode with First and Second Layer Sequences Having an Arrangement of Microprisms and Method for Producing the Same
Radiation-Emitting Semiconductor Chip
Method for Producing an Optoelectronic Component and Optoelectronic Component
Semiconductor Light Source
Optoelectronic Semiconductor Body and Light-Emitting Diode
Modular Module
Method of Producing an Optoelectronic Lighting Device and Optoelectronic Lighting Device
Method of Producing an Optoelectronic Component, and Optoelectronic Component
Application:
16/315,319 →
Publication:
US 2019/0214536
Lighting Device for a Mobile Terminal
Optoelectronic Semiconductor Chip
Component Having Semiconductor Bodies Electrically Conductively Connected via a Transition Zone
Optoelectronic Semiconductor Chip and Method for Producing an Optoelectronic Semiconductor Chip
Light Emitting Device
Semiconductor Laser Diode
Module for a Video Wall, and Method of Producing Same
Production of Optical Components
Semiconductor Layer Sequence Having Pre- and Post- Barrier Layers and Quantum Wells
Method of Autostereoscopic Imaging and Autostereoscopic Illumination Unit
Multi-Chip Module with Light-Emitting Diode (LED) Chips Configured for Surface Mount Technology (SMT)
Component Having Metal Carrier Layer and Reduced Overall Height
Method and Device for Measurement of a Plurality of Semiconductor Chips in a Wafer Array
Optoelectronic Semiconductor Chip
Silicone Composition
Detection Arrangement and Method for Producing Detection Arrangements
Phosphor, Illumination Device and Use of an Illumination Device
Method of Producing an Optoelectronic Component
Optoelectronic Device and Method of Producing an Optoelectronic Device
Optoelectronic Semiconductor Chip, Method for Producing an Optoelectronic Semiconductor Chip and Headlight Comprising an Optoelectronic Semiconductor Chip
Optoelectronic Component and Method for Producing an Optoelectronic Component
Optoelectronic Device Comprising a Scattering Element
Driver Circuit for Light-Emitting Component
A Method of Aligning Semiconductor Chips, Method of Arranging Semiconductor Chips, Device That Produces a Semiconductor Component, and Semiconductor Component
Arrangement Having a Carrier and an Optoelectronic Component
Optoelectronic Component
Method for Establishing Electrical Contact of a Semiconductor Layer and Semiconductor Component Having Electrical Contact
Component for Displaying a Pictogram and Method of Producing a Component
Optoelectronic Component and Method of Operating an Optoelectronic Component
Optoelectronic Device
Method of Producing an Outcoupling Element for an Optoelectronic Component and Outcoupling Element
Method of Producing Optoelectronic Semiconductor Components and an Optoelectronic Semiconductor Component
Method of Producing a Semiconductor Laser and Semiconductor Laser
Laser Component and Method of Producing a Laser Component
Sensor
Production of Sensors
Semiconductor Layer Sequence and Method for Producing a Semiconductor Layer Sequence
Heating Apparatus, Method and System for Producing Semiconductor Chips in the Wafer Assembly
Semiconductor Body
Semiconductor Laser and Method for Producing Such a Semiconductor Laser
Leadframe, Optoelectronic Component having a Leadframe, and Method for Producing an Optoelectronic Component
Production of Radiation-Emitting Semiconductor Components
Semiconductor Chip Transfer Method and Transfer Tool
Semiconductor Laser
Display Device with a Plurality of Separately Operable Pixels Formed in a Grid
Multipixel Led Component and Method of Operating a Multipixel Led Component
Single Photon Source and Method of Controlled Generation of Photons
Device That Illuminates a Defined Surface
Method of Producing Side-Emitting Components and Side-Emitting Component
Solder Pads of Variable Thickness in an Optoelectronic Semiconductor Chip, on a Connection Substrate for Mounting a Semiconductor Chip, Method of Producing an Optoelectronic Component, and Optoelectronic Component Having the Solder Pads
Method of Producing an Optoelectronic Semiconductor Chip and Optoelectronic Semiconductor Chip
Radiation-Emitting Semiconductor Body and Method of Producing a Semiconductor Layer Sequence
Optoelectronic Component
Component with an Optoelectronic Part
Method of Manufacturing a Plurality of Conversion Elements, Conversion Element and Optoelectronic Component
Optoelectronic Component
Radiation-Emitting Device
Optoelectronic Component and Method for Producing an Optoelectronic Component
Light Emitting Device and Method for Manufacturing Light Emitting Device
Method for Producing an Optoelectronic Semiconductor Chip and Optoelectronic Semiconductor Chip
Laser Diode Chip Having Coated Laser Facet
Optoelectronic Device, Conversion Element, Method of Producing a Plurality of Conversion Elements and Method of Producing an Optoelectronic Device
Optoelectronic Semiconductor Device and Method for Producing an Optoelectronic Semiconductor Device
Optoelectronic Semiconductor Device and Method of Manufacturing an Optoelectronic Semiconductor Device
Optoelectronic Semiconductor Device and Method for Manufacturing an Optoelectronic Semiconductor Device
Semiconductor Chip and Method for Producing a Semiconductor Chip
Surface-Mountable Semiconductor Laser, Arrangement with Such a Semiconductor Laser and Operating Method for Same
Optoelectronic Semiconductor Chip and Method of Producing an Optoelectronic Semiconductor Chip
Optoelectronic Semiconductor Chip and Method of Producing an Optoelectronic Semiconductor Chip
Optoelectronic Component
Optoelectronic Component
Optoelectronic Component, a Module Having at Least Two Optoelectronic Components, and a Method for Producing an Optoelectronic Component
Method of Producing a Semiconductor Component
Video-Wall Module with Different Light-Emitting Diode Chips Arranged in Different Areas
Method of Producing an Optoelectronic Semiconductor Component, and Optoelectronic Semiconductor Component
Method of Selecting Semiconductor Chips
White Light Source and Method of Producing a White Light Source
Method of Producing an Optoelectronic Element
Radiation-Emitting Semiconductor Chip
Semiconductor Laser Diode
Device Having a Reinforcement Layer and Method for Producing a Device
Device and Connection Carrier
Display Device
Optoelectronic Semiconductor Component and Method for Producing an Optoelectronic Semiconductor Component
Electrical Circuit and Method of Operating an Electrical Circuit
Application:
16/477,983 →
Publication:
US 2019/0364630
Optoelectronic Component and Method of Producing an Optoelectronic Component
Optoelectronic Component and Method for Producing an Optoelectronic Component
Sensor That Detects a Heart Rate and/or a Blood Oxygen Content, and Method of Operating a Sensor
Radiation-Emitting Semiconductor Arrangement and Device Having a Radiation-Emitting Semiconductor Arrangement
Optoelectronic Semiconductor Chip Based on a Phosphide Compound Semiconductor Material
Radiation-Emitting Semiconductor Body and Semiconductor Chip
Arrangement for Illuminating and Recording a Moving Scene
Radiation-Emitting Device
Optoelectronic Semiconductor Component
Optoelectronic Semiconductor Chip with Two Separate Light Emitting Layers
Measuring Arrangement Having an Optical Transmitter and an Optical Receiver
Method of Operating a Lighting Device
Led Unit
Method for Producing an Output Coupling Element for an Optoelectronic Component and Output Coupling Element
Method for Producing a Plurality of Optoelectronic Components, and Optoelectronic Component
Method of Operating an Optoelectronic Component and Optoelectronic Component
Method of Operating a Light-Emitting Device
Optoelectronic Component and Method for Producing an Optoelectronic Component
Method for the Self-Adjusted Exposure of Side Surfaces of a Semiconductor Body
Method for Producing Optoelectronic Semiconductor Components
Method of Separating a Component Using Predetermined Breaking Position and a Component Obatined by Such Method
Method of Operating a Camera System and Camera System
Method of Producing an Optoelectronic Component, and Optoelectronic Component
Arrangement for Operating Radiation Emitting Devices, Method of Manufacturing the Arrangement and Compensation Structure
Sensor Element
Assembly for Lighting and Recording a Scene
Illumination System, Electronic Device Comprising an Illumination System and Use of an Illumination System
Lighting Device and Method for Operating a Lighting Device
Conversion Element, Optoelectronic Component and Method for Producing a Conversion Element
Optoelectronic Component and Method for Producing an Optoelectronic Component
Application:
16/488,529 →
Publication:
US 2020/0006913
Semiconductor Body
Optoelectronic Component and Method for Producing an Optoelectronic Component
Method for Transferring Semiconductor Bodies and Semiconductor Chip
Optoelectronic Component Comprising a Laser Diode
Method of Producing Optoelectronic Semiconductor Components
Method of Manufacturing Light Emitting Diodes and Light Emitting Diode
Method of Fastening a Semiconductor Chip on a Lead Frame, and Electronic Component
Method of Producing Light-Emitting Diode Chips and Light-Emitting Diode Chip
Laser Bar and Semiconductor Laser and Method of Producing Laser Bars and Semiconductor Lasers
Light-Emitting Component and Method of Producing a Light-Emitting Component
Method for Producing at Least One Optoelectronic Component, and Optoelectronic Component
Semiconductor Radiation Source
Method of Manufacturing an Optoelectronic Semiconductor Chip and Optoelectronic Semiconductor Chip
3D Display Element
Surface Emitting Semiconductor Laser Monolithcally Intergrated on a Functional Carrier with a Plurality of Electronic Components and Free of Bonding Wires
Application:
16/493,062 →
Publication:
US 2020/0136348
Optoelectronic Semiconductor Component and Production Method
Application:
16/493,415 →
Publication:
US 2020/0135994
Method for Manufacturing a Radiation-Emitting Semiconductor Component and Radiation-Emitting Semiconductor Component
Method of Manufacturing Light Emitting Diodes and Light Emitting Diode
Optoelectronic Semiconductor Device and Method of Operating an Optoelectronic Semiconductor Device
Cover for an Optoelectronic Component and Optoelectronic Device
Method for Producing an Optoelectronic Component, and Optoelectronic Component
Display Device
Optoelectronic Semiconductor Chip and Method of Manufacturing the Same
Filament Structure, Lighting Device Having a Filament Structure, and Method for Producing a Lighting Device Having a Filament Structure
Method for Producing a Multiplicity of Radiation-Emitting Semiconductor Components, and Radiation-Emitting Semiconductor Component
Method for Manufacturing a Plurality of Surface Mounted Optoelectronic Devices and Surface Mounted Optoelectronic Device
Illumination Device and Illumination System
Method for Producing an Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component
Optoelectronic Component and Method for Manufacturing an Optoelectronic Component
Method for Producing an Output Coupling Element for an Optoelectronic Component and Optoelectronic Component
Method for Producing an Optoelectronic Component and Optoelectronic Component
Optoelectronic Component and Method of Manufacturing an Optoelectronic Component
Semiconductor Laser Diode and Method for Manufacturing a Semiconductor Laser Diode
Method for Producing a Plurality of Radiation-Emitting Semiconductor Devices with a Screen for a Screen Printing Process
Method for Producing a Semiconductor Chip and Semiconductor Chip
Optoelectronic Semiconductor Chip and Method of Producing an Optoelectronic Semiconductor Chip
Application:
16/603,007 →
Publication:
US 2020/0058840
Optoelectronic Sensor Module and Method for Producing an Optoelectronic Sensor Module
Method of Fastening a Semiconductor Chip on a Lead Frame, and Electronic Component
Radiation-Emitting Component and Method for Producing a Radiation-Emitting Component
Method for Producing an Illumination Device and Illumination Device
Optoelectronic Component
Illumination Device and Method for Manufacturing an Illumination Device
Radiation-Emitting Semiconductor Device and Fabric
Method of Producing a Radiation-Emitting Semiconductor Component, and Radiation-Emitting Semiconductor Component
Optoelectronic Semiconductor Chip and Method of Producing an Optoelectronic Semiconductor Chip
Optoelectronic Component Having an Optical Element with Different Inner Surface Regions
Radiation-Emitting Component
Semiconductor Laser Diode
Semiconductor Light Source
Semiconductor Laser Diode
Laser Diode and Method for Manufacturing a Laser Diode
Edge Emitting Semiconductor Laser and Method of Operating such a Semiconductor Laser
Semiconductor Laser Component and Method of Producing a Semiconductor Laser Component
Pulse Oximetry Device and Method of Operating a Pulse Oximetry Device
Application:
16/660,008 →
Publication:
US 2020/0046275
Optoelectronic Semiconductor Body and Method for Producing an Optoelectronic Semiconductor Body
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 8, 2014
From: BERGENEK, KRISTER
To: OSRAM GMBH
Reel/Frame 033491/0867 →
Assignment of Assignor's Interest
Jun 8, 2015
From: GEBUHR, TOBIAS; KNÖRR, MATTHIAS, DR.; MÜLLER, KLAUS, DR.; SCHWARZ, THOMAS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 035858/0102 →
Assignment of Assignor's Interest
Dec 15, 2015
From: HORN, MARKUS; AUEN, KARSTEN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 037292/0291 →
Assignment of Assignor's Interest
Mar 5, 2016
From: LÖFFLER, ANDREAS; MEYER, TOBIAS; BAUER, ADAM; LEIRER, CHRISTIAN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 037900/0373 →
Assignment of Assignor's Interest
May 23, 2016
From: TCHOUL, MAXIM; LENEF, ALAN; KUNDALIYA, DARSHAN
To: OSRAM SYLVANIA INC.
Reel/Frame 038687/0054 →
Assignment of Assignor's Interest
Jun 28, 2016
From: SCHWARZ, THOMAS; SINGER, FRANK; LINKOV, ALEXANDER; ILLEK, STEFAN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 039029/0383 →
Assignment of Assignor's Interest
Jul 14, 2016
From: NAGEL, PETER; ILLEK, STEFAN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 039158/0796 →
Assignment of Assignor's Interest
Oct 5, 2016
From: BRANDL, MARTIN; GEBUHR, TOBIAS; SCHWARZ, THOMAS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 039940/0780 →
Assignment of Assignor's Interest
Dec 5, 2016
From: STOLL, ION
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 040519/0310 →
Assignment of Assignor's Interest
Jan 11, 2017
From: MANDL, MARTIN; SCHIMPKE, TILMAN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 040951/0115 →
Assignment of Assignor's Interest
Jan 24, 2017
From: KIMME, FELIX; BRICK, PETER
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 041069/0036 →
Assignment of Assignor's Interest
Jan 30, 2017
From: BAUER, ADAM; MÖNCH, WOLFGANG; RACZ, DAVID; WITTMANN, MICHAEL
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 041556/0369 →
Assignment of Assignor's Interest
Feb 21, 2017
From: VON MALM, NORWIN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 041326/0475 →
Assignment of Assignor's Interest
Feb 23, 2017
From: KÖLPER, CHRISTOPHER; BRICK, PETER; KIMME, FELIX
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 041349/0587 →
Assignment of Assignor's Interest
Feb 27, 2017
From: SCHWARZ, THOMAS; SINGER, FRANK
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 041387/0596 →
Assignment of Assignor's Interest
Apr 11, 2017
From: MOOSBURGER, JÜRGEN; HÖPPEL, LUTZ; VON MALM, NORWIN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 041967/0613 →
Assignment of Assignor's Interest
May 11, 2017
From: HALBRITTER, HUBERT; GOEOETZ, BRITTA
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 042347/0489 →
Assignment of Assignor's Interest
Oct 19, 2018
From: OSRAM SYLVANIA INC.
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 047235/0006 →
Assignment of Assignor's Interest
Jun 20, 2019
From: STREPPEL, ULRICH; QUEREN, DÉSIRÉE
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 049539/0068 →
Corrective Assignment to Correct the Name of the Second Assignor's Last Name Previously Recorded on Reel 042347 Frame 0489. Assignor(S) Hereby Confirms the Assignment.
Jul 18, 2019
From: HALBRITTER, HUBERT; GÖÖTZ, BRITTA
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 050480/0053 →