Method for producing optoelectronic semiconductor components and optoelectronic modules, and optoelectronic semiconductor component and optoelectronic module

1. A method for producing a plurality of optoelectronic semiconductor components and/or at least one optoelectronic module, the method comprising:

inserting a plurality of optoelectronic semiconductor chips with a suitable orientation into a linear feeding device;

conveying the optoelectronic semiconductor chips to an injection device having an outlet opening;

encapsulating the optoelectronic semiconductor chips with at least one cladding layer in the injection device and pressing the encapsulated optoelectronic semiconductor chips out of the outlet opening, wherein a compound of optoelectronic semiconductor chips is formed in which the optoelectronic semiconductor chips are connected to one another by the at least one cladding layer; and

separating the compound into a plurality of optoelectronic semiconductor components each component having an optoelectronic semiconductor chip which is at least partially encapsulated by the at least one cladding layer, and/or separating the compound into at least one optoelectronic module comprising a plurality of optoelectronic semiconductor chips which are at least partially encapsulated and connected to one another by the at least one cladding layer.

2. The method according to claim 1 , wherein a shape of the outlet opening determines the shape of the optoelectronic semiconductor components or the optoelectronic module such that a cross-section of the outlet opening corresponds to a cross-section of the optoelectronic semiconductor components or the optoelectronic module.

3. The method according to claim 1 , wherein the outlet opening has a polygonal cross-section, and wherein a prismatic bond is formed when pressed out.

4. The method according to claim 1 , wherein the outlet opening has an oval cross-section, and wherein a cylindrical compound is produced when pressed out.

5. The method according to claim 1 , wherein the optoelectronic semiconductor chips are introduced one after the other into the feeding device.

6. The method according to claim 1 , wherein a material used for the cladding layer is supplied transversely to a conveying direction of the optoelectronic semiconductor chips.

7. The method according to claim 1 , wherein the injection device has a plurality of injection regions from which different materials are supplied.

8. The method according to claim 7 , wherein different cladding layers are produced from the different materials.

9. The method according to claim 7 , wherein the injection regions are arranged one after the other in a conveying direction of the optoelectronic semiconductor chips and various cladding layers are produced by the injection regions, wherein the cladding layers are arranged one after the other in a direction running transversely to the conveying direction starting from the optoelectronic semiconductor chips.

10. The method according to claim 1 , wherein at least one of the following materials is used for the at least one cladding layer: a thermoplastic resin or an epoxy resin or silicone.

11. The method according to claim 1 , wherein the optoelectronic semiconductor chips are introduced into the feeding device in a compound manner, the optoelectronic semiconductor chips being connected to one another by a mount and/or a connection means.