Optoelectronic semiconductor chip and method of manufacturing the same
An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.
1. An optoelectronic semiconductor chip comprising:
a plurality of fins; and
a current expansion layer for common contacting of at least some of the fins, each fin comprising:
two side surfaces arranged opposite one another; and
an active region arranged on each of the side surfaces,
wherein the plurality of fins comprises inner fins and outer fins having an adjacent fin only on one side,
wherein the current expansion layer is in direct contact with the inner fins on their outside, and
wherein at least one of the plurality of fins has a length which is at least 50% of an edge length of the semiconductor chip.
2. The optoelectronic semiconductor chip according to claim 1 ,
wherein at least one of the plurality of fins has end surfaces and a cover surface, and
wherein an area of each side surface is greater than an area of each end surface and an area of the cover surface.
3. The optoelectronic semiconductor chip according to claim 1 ,
wherein at least one of the plurality of fins is based on a III-V compound semiconductor material, and
wherein the side surfaces are parallel to an A-plane of a III-V compound semiconductor material.
4. The optoelectronic semiconductor chip according to claim 3 ,
wherein at least one of the plurality of fins extends parallel to a M-axis of the III-V compound semiconductor material.
5. The optoelectronic semiconductor chip according to claim 1 ,
wherein at least one of the plurality of fins has a length, a width and a height,
wherein the height is greater than the width, and
wherein a ratio of height to width is at least 2.
6. The optoelectronic semiconductor chip according to claim 5 , wherein the length is greater than the height.
7. The optoelectronic semiconductor chip according to claim 1 ,
wherein at least one of the plurality of fins has a core formed with a III-V compound semiconductor material of a first conductivity type and/or the fin has a first shell formed with a III-V compound semiconductor material of a first conductivity type,
wherein the fin has a second shell formed with a III-V compound semiconductor material of a second conductivity type different from the first conductivity type, and
wherein the active region of the fin is arranged between a core and the first shell and/or the core and the second shell.
8. The optoelectronic semiconductor chip according to claim 7 , wherein the core is exposed in at least one fin and the core is covered by a contact finger.
9. The optoelectronic semiconductor chip according to claim 8 , wherein the second shell of the fin is covered in places by the current expansion layer.
10. The optoelectronic semiconductor chip according to claim 1 , wherein the plurality of fins is arranged parallel to each other.
11. The optoelectronic semiconductor chip according to claim 1 , wherein some of the fins are arranged one behind the other along a straight line, a length of the fins extending along the straight line.
12. The optoelectronic semiconductor chip according to claim 1 , wherein the fins have active regions of the same design.
13. The optoelectronic semiconductor chip according to claim 1 , wherein the current expansion layer is radiation-transmissive and comprises a TCO (Transparent Conductive Oxide) material.
14. The optoelectronic semiconductor chip according to claim 1 , wherein the outer fins are covered with an insulating layer which directly adjoins the outer fins and the current expansion layer and electrically insulates the outer fins from the current expansion layer.
15. An optoelectronic semiconductor chip comprising:
a plurality of fins; and
a current expansion layer for common contacting of at least some of the fins, each fin comprising:
two side surfaces arranged opposite one another; and
an active region arranged on each of the side surfaces,
wherein the plurality of fins comprises inner fins and outer fins having an adjacent fin only on one side,
wherein the current expansion layer is in direct contact with the inner fins on their outside, and
wherein some of the fins are arranged one behind the other along a straight line, a length of the fins extending along the straight line.
16. An optoelectronic semiconductor chip comprising:
a plurality of fins; and
a current expansion layer for common contacting of at least some of the fins, each fin comprising:
two side surfaces arranged opposite one another; and
an active region arranged on each of the side surfaces,
wherein the plurality of fins comprises inner fins and outer fins having an adjacent fin only on one side,
wherein the current expansion layer is in direct contact with the inner fins on their outside, and
wherein the outer fins are covered with an insulating layer which directly adjoins the outer fins and the current expansion layer and electrically insulates the outer fins from the current expansion layer.