Method of producing an optoelectronic device with a frame projecting with circular receptacle section beyond a first side of a lens

1. A method of producing an optoelectronic device comprising:

providing an optical element comprising an optical lens and comprising a frame, wherein the frame projects with a circular all around receptacle section beyond a first side of the lens, the receptacle section of the frame encloses a receptacle space, and the receptacle section of the frame comprises a bearing face and an inner wall at an inner side, wherein the inner wall of the receptacle section encloses the receptacle space as a circumferential annular surface;

inserting an optoelectronic component and a transparent intermediate element into the receptacle space, wherein the transparent intermediate element is a plate, the circumferential annular surface of the inner wall surrounding the optoelectronic component and the plate;

placing the transparent intermediate element with outer edge regions onto the bearing face, wherein the plate covers the receptacle space above the first side of the lens; and

securing the optoelectronic component and the transparent intermediate element to the frame, wherein the transparent intermediate element is first inserted into the receptacle space and placed with the outer edge regions onto the bearing face of the frame, the optoelectronic component is inserted into the receptacle space and placed onto the transparent intermediate element, the optoelectronic component is formed as a radiation-emitting component, and the optoelectronic component is formed without a carrier in the form of semiconductor layers.

2. The method according to claim 1 , wherein the transparent intermediate element is secured to the frame via a first connection layer, the optoelectronic component is secured directly to the transparent intermediate element via a second connection layer, and the second connection layer comprises transparent adhesive.

3. The method according to claim 1 , wherein a circular interspace is formed between the optoelectronic component and the circumferential annular surface of the inner wall of the receptacle section of the frame, connection material is filled into the circular interspace filling up the circular interspace, wherein the connection material directly connects to side faces of the optoelectronic component and to the inner wall of the receptacle section, and the connection material connects the side faces of the optoelectronic component t 5 o the circumferential annular surface of the inner wall of the receptacle section of the frame.

4. The method according to claim 1 , wherein the optoelectronic component is formed as semiconductor layer structures only in the form of epitaxial semiconductor layers comprising electrical contacts.

5. The method according to claim 1 , wherein the bearing face of the frame is formed as a sealing surface, and the intermediate element bears with the outer edge regions on the bearing face in a sealing manner.

6. The method according to claim 1 , wherein a circular interspace is formed between side faces the optoelectronic component and the circumferential annular surface of the inner wall of the receptacle section of the frame, connection material is filled into the circular interspace, wherein the connection material surrounds the component, and the connection material directly connects the side faces of the component and the circumferential annular surface of the inner wall of the receptacle section of the frame.

7. A method of producing an optoelectronic device comprising:

providing an optical element comprising an optical lens and comprising a frame, wherein the frame projects with a receptacle section beyond a first side of the lens, the receptacle section of the frame surrounds a receptacle space, the receptacle section of the frame comprises a bearing face and an inner wall at an inner side, and the inner wall of the receptacle section surrounds the receptacle space;

wherein first an intermediate element is a plate and inserted into the receptacle space and placed onto the bearing face,

then, a conversion material plate is arranged on the intermediate element,

then, an optoelectronic component is inserted into the receptacle space and placed onto the conversion material plate,

wherein a circular interspace is formed between the optoelectronic component and the inner wall of the receptacle section of the frame,

wherein connection material is filled into the circular interspace, and the connection material surrounds the optoelectronic component and connects the optoelectronic component to the inner wall of the receptacle section of the frame.

8. A method of producing an optoelectronic device comprising:

providing an optical element comprising an optical lens and comprising a frame, wherein the frame projects with a circular all around receptacle section beyond a first side of the lens, the receptacle section of the frame encloses a receptacle space, and the receptacle section of the frame comprises a bearing face and an inner wall at an inner side, wherein the inner wall of the receptacle section encloses the receptacle space as a circumferential annular surface;

inserting an optoelectronic component and a transparent intermediate element into the receptacle space, wherein the transparent intermediate element is a plate, the circumferential annular surface of the inner wall surrounding the optoelectronic component and the plate;

placing the transparent intermediate element with outer edge regions onto the bearing face, wherein the plate covers the receptacle space above the first side of the lens; and

securing the optoelectronic component and the transparent intermediate element to the frame, wherein the optoelectronic component is first connected by a sheath to the transparent intermediate element to form a unit, the sheath is formed at side faces of the transparent intermediate element and at side faces of the optoelectronic component, the sheath surrounds the transparent intermediate element and the optoelectronic component, the unit comprising the optoelectronic component and the transparent intermediate element is introduced into the receptacle space and placed by the transparent intermediate element onto the bearing face, and the unit comprising the optoelectronic component and the transparent intermediate element is secured to the frame.