IP Library Granted Patent US 10,686,296
Granted Patent B2
US 10,686,296 · App. 15/764,411 · Granted Jun 16, 2020

Optoelectronic component

Inventors: Sven Gerhard (Alteglofsheim, DE); Alfred Lell (Maxhütte-Haidhof, DE); Clemens Vierheilig (Tegernheim, DE); Andreas Löffler (Neutraubling, DE)
Assignee: OSRAM OLED GmbH
H01S5/2205H01S5/22H01S5/3013H01S5/3018H01S5/0202H01S5/0224H01S5/2222H01S2301/176
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,686,296
App. No.
15/764,411
Granted
Jun 16, 2020
Kind
B2
Abstract

An optoelectronic component includes a layer structure including an active zone that generates electromagnetic radiation, wherein the active zone is arranged in a plane, the layer structure includes a top side and four side faces, the first and third side faces are arranged opposite one another, the second and fourth side faces are arranged opposite one another, a strip-type ridge structure is arranged on the top side of the layer structure, the ridge structure extends between the first side face and the third side face, the first side face constitutes an emission face for electromagnetic radiation, a first recess is introduced into the top side of the layer structure laterally alongside the ridge structure, a second recess is introduced into the first recess, and the second recess extends as far as the second side face.

Claims (16)

1. An optoelectronic component comprising:

a layer structure comprising an active zone that generates electromagnetic radiation, wherein the active zone is arranged in a plane, the layer structure further comprising a top side and four side faces, the first and third side faces arranged opposite one another, the second and fourth side faces arranged opposite one another,

a strip-type ridge structure is arranged on the top side of the layer structure, the ridge structure extending between the first side face and the third side face, the first side face constituting an emission face for electromagnetic radiation,

a first recess having a first wall face and a first base face disposed on the top side of the layer structure laterally alongside the ridge structure, the first wall face arranged perpendicularly to the top side, and the first base face arranged parallel to the top side, the first recess extending over an entire length of the component from the first side face to the third side face along the second side face, the first recess extending to the second side face,

a second recess disposed in the first base face of the first recess, the second recess having a smaller length than the first recess relative to the length of the component from the first side face and the third side face, the second recess extending to and along the second side face, and the second recess disposed symmetrically and centrally with respect to the length of the component at a distance from the first side face and at a distance from the third side face.

2. The component according to claim 1 , wherein at least one third recess is introduced into the first base face of the first recess laterally alongside the ridge structure.

3. The component according to claim 1 , wherein at least one third recess is introduced into the first base face of the first recess laterally alongside the ridge structure, and the third recess is introduced at least into the first or the third side face.

4. The component according to claim 1 , wherein at least one third recess is introduced into the first base face of the first recess laterally alongside the ridge structure, the third recess is arranged substantially parallel to the second side face, and the third recess is arranged at a distance from the first side face and at a distance from the third side face.

5. The component according to claim 1 , wherein the second recess extends 1% to 99% of a longitudinal side of a second side face.

6. The component according to claim 1 , wherein at least one third recess is introduced into the first base face of the first recess laterally alongside the ridge structure, and the second recess comprises a greater depth relative to the first base face of the first recess than the third recess.

7. The component according to claim 1 , wherein the second recess comprises a depth of 0.5 μm to 50 μm relative to the top side.

8. The component according to claim 1 , wherein the second recess comprises a depth of 0.5 μm to 50 μm, and the second recess comprises a depth of 2 μm to 6 μm relative to the top side.

9. The component according to claim 1 , wherein at least the second side face and the fourth side face are mirror-symmetrically configured, on both sides, with respect to a center plane, or the top sides arranged on opposite sides relative to the ridge structure are mirror-symmetrically configured with respect to the center plane.

10. The component according to claim 1 , wherein the component is a laser diode.

11. The component according to claim 10 , wherein the laser diode is produced from a III-V semiconductor material.

12. The component according to claim 10 , wherein the laser diode is produced from indium gallium nitride.

Assignments (3)
MERGER Recorded Feb 17, 2026
From: OSRAM OLED GMBH
To: AMS-OSRAM INTERNATIONAL GMBH
Reel/Frame 074881/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2018
From: GERHARD, SVEN; LELL, ALFRED; VIERHEILIG, CLEMENS; LOEFFLER, ANDREAS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 045668/0065 →