Method of aligning semiconductor chips, method of arranging semiconductor chips, device that produces a semiconductor component, and semiconductor component

1. A method of aligning semiconductor chips in a medium comprising:

providing an electrically insulating liquid medium;

providing semiconductor chips;

forming a suspension with the medium and the semiconductor chips;

exposing the semiconductor chips to electromagnetic radiation that generates free charge carriers in the semiconductor chips;

arranging the suspension in an electric field in which the semiconductor chips are aligned along the electric field; and

curing the medium after aligning the semiconductor chips.

2. The method according to claim 1 , wherein the medium is transparent for the electromagnetic radiation used to generate the free charge carriers.

3. The method according to claim 1 , wherein the exposure of the semiconductor chips to electromagnetic radiation and arrangement of the suspension in an electric field takes place simultaneously.

4. The method chips according to claim 1 , wherein the electric field is formed between a first and a second electrode, and a distance of the suspension to the first electrode is smaller than a distance to the second electrode.

5. The method according to claim 1 , wherein the semiconductor chips comprise a region with a band gap, and the electromagnetic radiation has an energy greater than the energy of the band gap.

6. A method of arranging semiconductor chips on a carrier comprising performing the method according to claim 1 , wherein the suspension is arranged on the carrier.

7. The method according to claim 6 , wherein the suspension is arranged on the carrier by a printing process.

8. The method according to claim 6 , wherein the first electrode is in direct contact with the carrier.

9. The method according to claim 6 , wherein, after aligning the semiconductor chips, the medium is cured.

10. The method according to claim 9 , wherein, after curing the medium, a side of the semiconductor chips facing away from the carrier is free of the medium or is exposed in selected locations.

11. The method according to claim 7 , wherein, after aligning the semiconductor chips, the medium is completely removed.

12. The method according to claim 9 , wherein, after curing or removal of the medium, at least 70% of the semiconductor chips are in direct contact with the carrier.

13. The method according to claim 6 , wherein the carrier is adapted to be used in a roll-to-roll process.

14. The method according to claim 6 , wherein the carrier is the first electrode by which the electric field is generated.

15. A device that produces a semiconductor component having a light source, a first electrode, and a second electrode, comprising:

means for adapting the light source to illuminate a region between the first and the second electrode with electromagnetic radiation,

means for adapting the first and the second electrode to generate in the region an electric field,

means for providing a suspension comprising a medium and semiconductor chips that arranges an electric field between the electrodes, and

means for arranging a light source such that the second electrode has a surface with at least one cut-out, or the second electrode has a surface on which a light guide is arranged.

16. The device according to claim 15 , wherein the second electrode has a surface with at least one cut-out, and in the cut-out a light source is arranged.

17. The device according to claim 15 , wherein the second electrode has a surface on which a light guide is arranged.

18. A semiconductor component comprising a carrier and a plurality of semiconductor chips, wherein

the semiconductor chips each have a n-conducting region and a p-conducting region,

at least 70% of the semiconductor chips have the same orientation and are in direct contact with the carrier,

the semiconductor chips have a maximum edge length of 10 μm,

the semiconductor chips are arranged on the carrier by printing, and

the semiconductor chips are surrounded in the lateral plane by a cured medium.

19. The semiconductor component according claim 18 , wherein

the semiconductor chips are electrically conductively contacted and operated via the carrier and an electrical contact, and

the electrical contact is arranged on the side of the semiconductor chip facing away from the carrier.