Optoelectronic component and method of producing an optoelectronic component
An optoelectronic component includes a housing including a first cavity bounded by a first wall, wherein a circumferentially extending first step is formed at an inner side of the first wall, the first step circumferentially extends around the first cavity obliquely with respect to a bottom of the first cavity, a first optoelectronic semiconductor chip is arranged at the bottom of the first cavity, the first optoelectronic semiconductor chip is embedded into a first potting material arranged in the first cavity and extending from the bottom of the first cavity as far as the first step, and a first potting surface of the first potting material is formed at the first step.
1. An optoelectronic component comprising a housing comprising a first cavity bounded by a first wall, wherein a circumferentially extending first step is formed at an inner side of the first wall, the first step circumferentially extends around the first cavity obliquely with respect to a bottom of the first cavity, a first optoelectronic semiconductor chip is arranged at the bottom of the first cavity, the first optoelectronic semiconductor chip is embedded into a first potting material arranged in the first cavity and extending from the bottom of the first cavity as far as the first step, a first potting surface of the first potting material is formed at the first step, and the first potting surface of the first potting material is likewise formed obliquely in a manner corresponding to an angle of inclination of the first step formed obliquely with respect to the bottom of the first cavity.
2. The optoelectronic component according to claim 1 , wherein the first step is an acute-angle at least in sections.
3. The optoelectronic component according to claim 1 , wherein the first potting surface is convex.
4. The optoelectronic component according to claim 1 , wherein the first potting surface is concave.
5. The optoelectronic component according to claim 1 , wherein the first potting material comprises a silicone or an epoxy.
6. The optoelectronic component according to claim 1 , wherein the first optoelectronic semiconductor chip is configured to emit electromagnetic radiation passing through the first potting surface in a perpendicular direction with respect to the bottom of the first cavity.
7. The optoelectronic component according to claim 1 , wherein the housing comprises a second cavity bounded by a second wall, a circumferentially extending second step is formed at an inner side of the second wall, the second step circumferentially extends around the second cavity obliquely with respect to a bottom of the second cavity, a second optoelectronic semiconductor chip is arranged at the bottom of the second cavity, the second optoelectronic semiconductor chip is embedded into a second potting material arranged in the second cavity and extending from the bottom of the second cavity as far as the second step, and a second potting surface of the second potting material is formed at the second step.
8. The optoelectronic component according to claim 7 , wherein the second potting surface is inclined oppositely compared to the first potting surface.
9. The optoelectronic component according to claim 7 , wherein the second optoelectronic semiconductor chip is configured to detect electromagnetic radiation.
10. A method of ascertaining a pulse rate and/or an oxygen saturation by utilizing an optoelectronic component according to claim 7 comprising:
emitting electromagnetic radiation by the first optoelectronic semiconductor chip, and
detecting electromagnetic radiation scattered in a patient's skin in a pulse-dependent manner.