Light-emitting semiconductor chip and optoelectronic component
A light-emitting semiconductor chip comprises: a radiation-transmissive substrate, an epitaxially grown semiconductor layer sequence on a main surface of the substrate, a first contact and a second contact on a contact surface of the semiconductor layer sequence facing away from the substrate for electrical and mechanical contacting of the semiconductor chip, a transparent, electrically conductive layer which is arranged on the contact side and is electrically connected to the first contact.
1. A light-emitting semiconductor chip, comprising:
a radiation-transmissive substrate,
an epitaxially grown semiconductor layer sequence on a main surface of the substrate,
a first contact and a second contact on a contact side of the semiconductor layer sequence facing away from the substrate for electrical and mechanical contacting of the semiconductor chip,
a transparent, electrically conductive layer which is arranged on the contact side and is electrically connected to the first contact.
2. The semiconductor chip according to claim 1 , which is designed as a volume emitter, so that during operation of the semiconductor chip generated electromagnetic radiation is decupled via a front side, a back side and side surfaces of the semiconductor chip.
3. The semiconductor chip according to claim 1 , wherein the first contact and the second contact are disposed on the contact side between the transparent electrically conductive layer.
4. The semiconductor chip according to claim 1 , wherein the first contact and the second contact are each arranged in a central region of the contact side.
5. The semiconductor chip according to claim 1 , wherein an area ratio between 30% and 90% of the contact side is covered by the transparent, electrically conductive layer.
6. An optoelectronic component, comprising:
a semiconductor chip comprising:
a radiation-transmissive substrate,
an epitaxially grown semiconductor layer sequence on a main surface of the substrate,
a first contact and a second contact on a contact surface of the semiconductor layer sequence facing away from the substrate for electrical and mechanical contacting of the semiconductor chip,
a transparent, electrically conductive layer which is arranged on the contact side and is electrically connected to the first contact,
a carrier having a first electrical conductor and a second electrical conductor, wherein
the first contact is electrically and mechanically coupled to the first conductor and the second contact is electrically and mechanically coupled to the second conductor, and
the transparent, electrically conductive layer has a distance to the carrier along a stacking direction of the semiconductor layer sequence.
7. The component according to claim 6 , wherein a converter for wavelength conversion is arranged between the transparent, electrically conductive layer and the carrier.
8. The component according to claim 7 , comprising a further converter for wavelength conversion, which is arranged on a side of the substrate facing away from the contact side.
9. The component according to claim 8 , wherein the converter and the further converter have mutually different concentrations of converter material.
10. The component according to claim 8 , wherein the converter and the further converter comprise mutually different materials.
11. The component according to claim 7 , wherein the first electrical conductor and the second electrical conductor each are configured to be reflective for converted radiation.
12. The component according to claim 7 , wherein the first electrical conductor and the second electrical conductor each comprise a recessed region, in which the converter is arranged.
13. The component according to claim 6 , wherein the first contact and second contact each have a projecting region coupled to the respective track to form the distance to the carrier.
14. The component according to claim 6 , wherein the first electrical conductor and second electrical conductor each have a projecting region coupled to the respective contact to form the distance to the carrier.
15. The component according to claim 6 , wherein the first contact and the second contact are arranged between the substrate and the two electrical conductors along the stacking direction.