IP Library Granted Patent US 11,070,025
Granted Patent B2
US 11,070,025 · App. 16/491,184 · Granted Jul 20, 2021

Semiconductor radiation source

Inventors: Andreas Wojcik (Regensburg, DE); Hubert Halbritter (Dietfurt, DE); Josip Maric (Sinzing, DE)
Assignee: OSRAM OLED GmbH
H01S5/0261H01S5/026H01S5/0236H01S5/0237H01S5/02345H01S5/042H01S5/0428H01S5/06216H01S5/06825
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Quick Facts
Patent No.
US 11,070,025
App. No.
16/491,184
Granted
Jul 20, 2021
Kind
B2
Abstract

A semiconductor radiation source includes at least one semiconductor chip that generates radiation; a controller with one or more switching elements configured for pulsed operation of the semiconductor chip; and at least one capacitor body, wherein the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the controller electrically connects to a side of the semiconductor chip opposite the capacitor body, and the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the capacitor body is located between the control unit and the semiconductor chip.

Claims (43)

1. A semiconductor radiation source comprising:

at least one semiconductor chip that generates radiation;

a controller with one or more switching elements configured for pulsed operation of the semiconductor chip; and

at least one capacitor body,

wherein

the semiconductor chip directly electrically connects in a planar manner to the capacitor body,

the controller electrically connects to a side of the semiconductor chip opposite the capacitor body, and

the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the capacitor body is located between the controller and the semiconductor chip.

2. The semiconductor radiation source according to claim 1 ,

wherein the semiconductor chip is a semiconductor laser chip, and

the capacitor body has a larger base area than the semiconductor chip and an electrical contact area between the semiconductor chip and the capacitor body is at least 50% of the base area.

3. The semiconductor radiation source according to claim 1 , wherein the semiconductor chip and the capacitor body have equal lateral dimensions along each direction with a tolerance of at most 10%, and an electrical contact area between the semiconductor chip and the capacitor body is at least 80% of a base surface of the semiconductor chip.

4. The semiconductor radiation source according to claim 1 ,

wherein the semiconductor chip and the capacitor body are soldered to each other, and

a main emission direction of the semiconductor chip is parallel to a base surface of the semiconductor chip and a base surface of the capacitor body.

5. The semiconductor radiation source according to claim 1 ,

wherein the semiconductor chip is a ridge waveguide laser,

a ridge waveguide of the semiconductor chip is arranged on a side of the semiconductor chip facing away from the capacitor body.

6. The semiconductor radiation source according to claim 1 , wherein the capacitor body is monolithically designed as a chip and is based on silicon.

7. The semiconductor radiation source according to claim 1 , wherein the capacitor body is composed of a plurality of individual capacitors that electrically connect in parallel.

8. The semiconductor radiation source according to claim 1 , wherein a direct, planar electrical connection between the semiconductor chip and the capacitor body has an inductance of at most 50 pH.

9. The semiconductor radiation source according to claim 1 ,

wherein the capacitor body has a capacity of at least 20 nF,

the semiconductor radiation source can be surface-mounted, and

a total thickness of the capacitor body together with the semiconductor chip is at least 0.1 mm and at most 0.5 mm.

10. The semiconductor radiation source according to claim 1 , comprising a plurality of the semiconductor chips that are regularly arranged in a two-dimensional array as seen in plan view,

wherein all the semiconductor chips are arranged together on a single capacitor body.

11. The semiconductor radiation source according to claim 1 , comprising a plurality of the capacitor bodies and a plurality of the semiconductor chips regularly arranged in a two-dimensional array as seen in plan view,

wherein the semiconductor chips are mounted on the capacitor bodies in a one-to-one manner.

12. A semiconductor radiation source comprising:

at least one semiconductor chip that generates radiation; and

at least one capacitor body,

wherein

the semiconductor chip and the capacitor body are stacked on top of each other,

the semiconductor chip directly electrically connects in a planar manner to the capacitor body, and

the capacity body is comprised of a plurality of individual capacitators that electrically connect in parallel.

13. The semiconductor radiation source according to claim 12 , further comprising a controller having one or more switching elements for pulsed operation of the semiconductor chip,

wherein the controller electrically connects to a side of the semiconductor chip opposite the capacitor body.

14. The semiconductor radiation source according to claim 13 , wherein the controller and the capacitor body are arranged next to each other on a common carrier.

15. The semiconductor radiation source according to claim 13 , wherein the controller, the capacitor body and the semiconductor chip are stacked on top of each other.

16. The semiconductor radiation source according to claim 13 ,

wherein the controller, the capacitor body and the semiconductor chip are stacked on top of each other so that the semiconductor chip is located between the controller and the capacitor body, and

the semiconductor chip electrically connects directly to the controller and the capacitor body.

Assignments (3)
MERGER Recorded Feb 17, 2026
From: OSRAM OLED GMBH
To: AMS-OSRAM INTERNATIONAL GMBH
Reel/Frame 074881/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051464/0504 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2019
From: WOJCIK, ANDREAS; HALBRITTER, HUBERT; MARIC, JOSIP
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 050686/0801 →