Semiconductor layer sequence and method for producing a semiconductor layer sequence

1. A semiconductor layer sequence comprising:

a first nitridic compound semiconductor layer;

an intermediate layer;

a second nitridic compound semiconductor layer; and

an active layer,

wherein these layers are grown one above the other and one after the other in the recited order and wherein these layers are directly adjacent to each other,

wherein the intermediate layer comprises an AlGaN layer with an Al content of at least 5%,

wherein the second nitridic compound semiconductor layer has a lower proportion of Al than the AlGaN layer such that relaxed lattice constants of the AlGaN layer of the intermediate layer and of the second nitridic compound semiconductor layer differ,

wherein the second nitridic compound semiconductor layer and the active layer are grown on the intermediate layer in a lattice-matched manner so that a tension of a crystal lattice occurs at least in the intermediate layer or the second nitridic compound semiconductor layer,

wherein the active layer comprises one or more layers of AlInGaN,

wherein an In content in each of the layers of AlInGaN is at most 12%,

wherein the intermediate layer comprises at least one first layer of Al a In b Ga 1-a-b N with 0≤a≤1, 0<b≤1 and a+b≤1 and at least one second layer of Al c In d Ga 1-c-d N with 0<c≤1, 0≤d≤1 and c+d≤1, where a<c and b>d applies,

wherein the individual layers of the intermediate layer are grown in a lattice-matched manner with respect to one another so that the layers of the intermediate layer are at least partially stressed, and

wherein the intermediate layer is grown on the first nitridic compound semiconductor layer in a lattice-matched manner.

2. The semiconductor layer sequence according to claim 1 , further comprising a third layer of GaN disposed between the first layer of Al a In b Ga 1-a-b N and the second layer of Al c In d Ga 1-c-d N, wherein the third layer is in direct contact with the first layer of Al a In b Ga 1-a-b N and the second layer of Al c In d Ga 1-c-d N.

3. The semiconductor layer sequence according to claim 1 , wherein the intermediate layer comprises a superlattice having alternately arranged first layers of InGaN or GaN and second layers of AlGaN.

4. The semiconductor layer sequence according to claim 1 , wherein a distance between the intermediate layer and the active layer is at most 500 nm.

5. The semiconductor layer sequence according to claim 1 ,

wherein the active layer reproduces a surface structure of a surface of the intermediate layer facing the active layer, and

wherein a mean roughness of a surface of the active layer is at least 0.5 nm.

6. The semiconductor layer sequence according to claim 1 , wherein the first and second nitridic compound semiconductor layers consist essentially of GaN.

7. The semiconductor layer sequence according to claim 1 ,

wherein the intermediate layer is formed from AlGaN, and

wherein the intermediate layer is grown on the first nitridic compound semiconductor layer in a non-lattice-matched manner.

8. The semiconductor layer sequence according to claim 7 ,

wherein the intermediate layer has an aluminum content greater than an aluminum content of the second nitridic compound semiconductor layer, and

wherein the second nitridic compound semiconductor layer is compression-stressed.

9. The semiconductor layer sequence according to claim 1 , wherein a distance between the intermediate layer and the active layer is at most 2.5 μm.

10. The semiconductor layer sequence according to claim 1 , further comprising a growth substrate, wherein the growth substrate of the semiconductor layer sequence is a sapphire substrate.

11. The semiconductor layer sequence according to claim 1 , further comprising a growth substrate, wherein the growth substrate of the semiconductor layer sequence is a pre-structured substrate.

12. The semiconductor layer sequence according to claim 1 , wherein the active layer comprises one or more quantum wells of AlInGaN, each quantum well having an In content of at most 12%.

13. An optoelectronic semiconductor chip comprising:

the semiconductor layer sequence according to claim 1 ,

wherein the active layer is configured to generate electromagnetic radiation during operation, and

wherein a maximum intensity of the radiation produced in the active layer is between 365 nm and 415 nm inclusive.

14. A semiconductor layer sequence comprising:

a first nitridic compound semiconductor layer;

an intermediate layer;

a second nitridic compound semiconductor layer; and

an active layer,

wherein these layers are grown one above the other and one after the other in the recited order and wherein these layers are directly adjacent to each other,

wherein the intermediate layer consists essentially of an AlGaN layer with an Al content of at least 5%,

wherein the second nitridic compound semiconductor layer has a lower proportion of Al than the AlGaN layer such that relaxed lattice constants of the AlGaN layer of the intermediate layer and of the second nitridic compound semiconductor layer differ,

wherein the second nitridic compound semiconductor layer and the active layer are grown on the intermediate layer in a lattice-matched manner so that a tension of a crystal lattice occurs at least in the intermediate layer or the second nitridic compound semiconductor layer,

wherein the active layer comprises one or more layers of AlInGaN and an In content in each of these layers of AlInGaN is at most 12%, and

wherein the intermediate layer is grown on the first nitridic compound semiconductor layer in a non-lattice-matched manner.

15. The semiconductor layer sequence according to claim 14 , wherein a distance between the intermediate layer and the active layer is at most 500 nm.

16. The semiconductor layer sequence according to claim 14 , wherein a distance between the intermediate layer and the active layer is at most 2.5 μm.

17. The semiconductor layer sequence according to claim 14 ,

wherein the active layer reproduces a surface structure of a surface of the intermediate layer facing the active layer, and

wherein a mean roughness of a surface of the active layer is at least 0.5 nm.

18. The semiconductor layer sequence according to claim 14 , wherein the first and second nitridic compound semiconductor layers consist essentially of GaN.

19. The semiconductor layer sequence according to claim 14 , further comprising a growth substrate, wherein the growth substrate of the semiconductor layer sequence is a sapphire substrate.