Optoelectronic component with protective circuit
An optoelectronic component includes at least one first carrier with at least two light emitting diodes, wherein the diodes have electrical connections, the electrical connections are led to contact areas, and the contact areas are arranged on an underside of the first carrier; and a second carrier, wherein further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier, and an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier.
1. An optoelectronic component comprising:
at least one first carrier with at least two light emitting diodes, wherein the diodes have electrical connections, the electrical connections are led to contact areas, and the contact areas are arranged on an underside of the first carrier; and
a second carrier,
wherein further contact areas are arranged on a top side of the second carrier, the first carrier bears by the underside on the top side of the second carrier and fixedly connects to the second carrier,
wherein an electronic circuit for open-loop and/or closed-loop control of the power supply of the diodes is integrated in the second carrier, at least two zener diodes are arranged in the second carrier, the zener diodes have further electrical connections, each further electrical connection is led to a further contact area, and the further connections of the at least two zener diodes are insulated from one another and an electrically conductive connection of the two zener diodes is produced via an electrical line, and the electrical line is on or in the first carrier.
2. The component as claimed in claim 1 , wherein the first carrier comprises a semiconducting layer in which the diodes are embodied.
3. The component as claimed in claim 1 , wherein the first carrier and/or the second carrier are/is at least part of a wafer.
4. The component as claimed in claim 1 , wherein the first carrier and/or the second carrier are/is at least part of a silicon wafer.
5. The component of claim 1 , wherein, between two contact areas, at least two diodes are arranged in a manner connected in series and/or in parallel and/or wherein between two further contact areas at least two zener diodes are arranged in a manner connected in series and/or in parallel.
6. The component as claimed in claim 1 , wherein a controllable switch is provided in parallel with at least one diode, the switch is integrated in the second carrier, a control circuit is integrated in the second carrier, and the control circuit connects to the switch.
7. The component as claimed in claim 1 , wherein a sensor is integrated in the second carrier, the sensor connects to a control circuit, and the sensor is an optical sensor or a temperature sensor.