Optoelectronic component and method for producing an optoelectronic component

1. An optoelectronic component comprising:

a semiconductor layer sequence having an active region configured to emit radiation at least via a main radiation exit surface during operation; and

a self-supporting conversion element arranged in a beam path of the semiconductor layer sequence,

wherein the self-supporting conversion element comprises a substrate and subsequently a first layer,

wherein the first layer comprises at least one conversion material embedded in a matrix material,

wherein the conversion material in the matrix material has a concentration gradient,

wherein the first layer comprises a surface facing away from the substrate, in which particles of the conversion material are partially not covered by the matrix material,

wherein the surface is smooth,

wherein the matrix material comprises at least one condensed sol-gel material selected from the group consisting of water glass, metal phosphate, monoaluminum phosphate, aluminum phosphate, modified monoaluminum phosphate, alkoxytetramethoxysilane, tetraethylorthosilicate, methyltrimethoxysilane, methyltriethoxysilane, titanium alkoxide, silica sol, metal alkoxide, metal oxane and metal alkoxane,

wherein the condensed sol-gel material has a proportion between 10 and 70 vol % in the first layer, and

wherein the substrate is free of the sol-gel material and the conversion material and mechanically stabilizes the first layer.

2. The optoelectronic component according to claim 1 , wherein the substrate is glass, glass ceramic, sapphire, a transparent ceramic or a translucent ceramic.

3. The optoelectronic component according to claim 1 , wherein the self-supporting conversion element is arranged on the main radiation exit surface by an adhesive.

4. The optoelectronic component according to claim 3 , wherein the adhesive is a silicone and the self-supporting conversion element is free of silicone.

5. The optoelectronic component according to claim 3 , wherein the adhesive comprises a thickness of 500 nm to 15 μm.

6. The optoelectronic component according to claim 1 , wherein the first layer comprises a layer thickness between 20 μm and 70 μm for partial conversion or 30 μm to 150 μm for full conversion.

7. The optoelectronic component according to claim 1 , wherein the first layer is disposed on the main radiation exit surface by an adhesive, and wherein the first layer is disposed directly on the substrate.

8. The optoelectronic component according to claim 1 , wherein the optoelectronic component is configured to emit the radiation with a color temperature between 2500 K and 4500 K during the operation.

9. The optoelectronic component according to claim 1 , wherein the optoelectronic component is configured to emit the radiation with a color temperature between 4500 K and 8000 K during the operation.

10. The optoelectronic component according to claim 1 , wherein the condensed sol-gel material comprises a proportion between 20 and 50 vol % in the first layer.

11. The optoelectronic component according to claim 1 , wherein the at least one conversion material is selected from the group consisting of (Y,Gd,Tb,Lu) 3 (Al,Ga) 5 O 12 :Ce 3+ , (Sr,Ca)AlSiN 3 :Eu 2+ , (Sr,Ba,Ca,Mg) 2 Si 5 N 8 :Eu 2+ , (Ca,Sr,Ba) 2 SiO 4 :Eu 2+ , α-SiAlON:Eu 2+ , β-SiAlON:Eu 2+ , (Sr,Ca)S:Eu 2 , (Sr,Ba,Ca) 2 (Si,Al) 5 (N,O) 8 :Eu 2+ , (Ca,Sr) 8 Mg(SiO 4 ) 4 Cl 2 :Eu 2+ , and (Sr,Ba)Si 2 N 2 O 2 :Eu 2+ .

12. The optoelectronic component according to claim 1 , wherein at least two different conversion materials are embedded in the matrix material.

13. The optoelectronic component according to claim 1 , wherein the substrate comprises a thickness of 50 μm to 200 μm.

14. The optoelectronic component according to claim 1 , wherein the matrix material is the condensed sol-gel material prepared from an aluminum phosphate solution or from a monoaluminum phosphate solution or from a modified monoaluminum phosphate solution.

15. A method for producing the optoelectronic component according to claim 1 , the method comprising:

providing the semiconductor layer sequence comprising the active region; and

applying the conversion element at least to the main radiation exit surface, wherein the conversion element is produced as follows:

introducing the at least one conversion material into the matrix material to form a dispersion, wherein the matrix material comprises at least one solution of a sol-gel material selected from the group consisting of the water glass, the metal phosphate, the monoaluminum phosphate, the aluminum phosphate, the modified monoaluminum phosphate, the alkoxytetramethoxysilane, the tetraethylorthosilicate, the methyltrimethoxysilane, the methyltriethoxysilane, the titanium alkoxide, the silica sol, the metal alkoxide, the metal oxane and the metal alkoxane;

applying the dispersion to the substrate to form the first layer, wherein the substrate is free of the sol-gel material and the conversion material;

heating the substrate and the first layer to a maximum of 550° C.; and

optionally smoothing the surface of the first layer facing away from the substrate.

16. The method according to claim 15 , further comprising separating the substrate and the first layer to produce a plurality of conversion elements, wherein at least one conversion element is arranged on the main radiation exit surface.

17. The optoelectronic component according to claim 1 , wherein the conversion element is free of fillers.

18. An optoelectronic component comprising:

a semiconductor layer sequence having an active region configured to emit radiation at least via a main radiation exit surface during operation; and

a self-supporting conversion element arranged in a beam path of the semiconductor layer sequence,

wherein the self-supporting conversion element is arranged on the main radiation exit surface by an adhesive,

wherein the adhesive is a silicone and the self-supporting conversion element is free of silicone,

wherein the adhesive comprises a thickness of 2 μm to 7 μm,

wherein the self-supporting conversion element comprises a substrate and subsequently a first layer,

wherein the first layer is disposed between the main radiation exit surface and the substrate,

wherein the first layer comprises a surface facing away from the substrate, in which particles of at least one conversion material are partially not covered by a matrix material,

wherein the surface is smooth,

wherein the at least one conversion material is embedded in the matrix material in the first layer,

wherein the matrix material comprises at least one condensed sol-gel material selected from the group consisting of water glass, metal phosphate, monoaluminum phosphate, aluminum phosphate, modified monoaluminum phosphate, alkoxytetramethoxysilane, tetraethylorthosilicate, methyltrimethoxysilane, methyltriethoxysilane, titanium alkoxide, silica sol, metal alkoxide, metal oxane and metal alkoxane,

wherein the condensed sol-gel material has a proportion between 10 and 70 vol % in the first layer, and

wherein the substrate is free of the sol-gel material and the conversion material and mechanically stabilizes the first layer.

19. An optoelectronic component comprising:

a semiconductor layer sequence having an active region configured to emit radiation at least via a main radiation exit surface during operation; and

a self-supporting conversion element arranged in a beam path of the semiconductor layer sequence,

wherein the self-supporting conversion element comprises a substrate and subsequently a first layer,

wherein the first layer comprises at least one conversion material embedded in a matrix material,

wherein the first layer comprises a surface facing away from the substrate, in which particles of the conversion material are partially not covered by the matrix material and wherein the surface is smooth, wherein the matrix material comprises at least one condensed sol-gel material selected from the group consisting of water glass, metal phosphate, monoaluminum phosphate, aluminum phosphate, modified monoaluminum phosphate, alkoxytetramethoxysilane, tetraethylorthosilicate, methyltrimethoxysilane, methyltriethoxysilane, titanium alkoxide, silica sol, metal alkoxide, metal oxane and metal alkoxane,

wherein the condensed sol-gel material has a proportion between 10 and 70 vol % in the first layer,

wherein the substrate is free of the sol-gel material and the conversion material and mechanically stabilizes the first layer, and

wherein the substrate comprises a decoupling foil or decoupling structure.