Optoelectronic semiconductor chip
An optoelectronic semiconductor chip is disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor body comprising a first semiconductor structure, a second semiconductor structure and an active region between the first and the second semiconductor structure and a plurality of recesses, each penetrating at least one of the semiconductor structures and the active region, wherein a cover surface of the active region is a continuous surface, and wherein at least in some of the recesses, surfaces of the recesses are completely covered with an electrically insulating material.
1. An optoelectronic semiconductor chip comprising:
a semiconductor body comprising a first semiconductor structure, a second semiconductor structure and an active region between the first and second semiconductor structures; and
at least 1000 recesses, each recess penetrating at least one of the semiconductor structures and the active region,
wherein a cover surface of the active region is a continuous surface,
wherein at least in some of the recesses, surfaces of the recesses are completely covered with an electrically insulating material,
wherein the recesses are arranged over an entire surface of a first or second semiconductor structure in a lateral plane at regular intervals, and
wherein the semiconductor body comprises a via completely penetrating the second semiconductor structure and the active region perpendicular to its main extension plane.
2. The optoelectronic semiconductor chip according to claim 1 , wherein the electrically insulating material is a dielectric material.
3. The optoelectronic semiconductor chip according to claim 1 , wherein the active region comprises a plurality of five or more quantum well structures.
4. The optoelectronic semiconductor chip according to claim 1 , wherein the active region is configured to generate electromagnetic radiation with a wavelength longer than 460 nm.
5. The optoelectronic semiconductor chip according to claim 1 , wherein the first or second semiconductor structure, which is completely penetrated by the recesses, is p-conducting.
6. The optoelectronic semiconductor chip according to claim 1 , wherein the surfaces of the recesses have traces of an etching process.
7. The optoelectronic semiconductor chip according to claim 1 , wherein the recesses partially penetrate into the first or second semiconductor structure, which is not completely penetrated by the recesses.
8. The optoelectronic semiconductor chip according to claim 1 , wherein the active region has at least one second energy level which lies energetically between a first energy level and a third energy level, and wherein the first energy level is the most energetically favorable energy level of a valence band in the active region outside a quantum well structure and the third energy level is the most energetically favorable energy level of quantized hole states in a quantum well structure of the active region.
9. The optoelectronic semiconductor chip according to claim 1 , wherein the active region has at least one further second energy level, which lies energetically between a further first energy level and a further third energy level, and wherein the further first energy level is the most energetically favorable energy level of a conduction band in the active region outside a quantum well structure and the further third energy level is the most energetically favorable energy level of a quantized electron states in a quantum well structure of the active region.
10. A optoelectronic semiconductor chip comprising:
a semiconductor body comprising a first semiconductor structure, a second semiconductor structure and an active region between the first and second semiconductor structures; and
at least 1000 recesses, each recess penetrating at least one of the semiconductor structures and the active region,
wherein a cover surface of the active region is a continuous surface,
wherein the active region comprises a plurality of five or more quantum well structures,
wherein, at least in some of the recesses, surfaces of the recesses are completely covered with an electrically insulating material,
wherein the recesses are arranged over an entire surface of a first or second semiconductor structure in a lateral plane at regular intervals, and
wherein the semiconductor body comprises a via completely penetrating the second semiconductor structure and the active region perpendicular to its main extension plane.
11. An optoelectronic semiconductor chip comprising:
a semiconductor body comprising a first semiconductor structure, a second semiconductor structure and an active region between the first and second semiconductor structures; and
a plurality of recesses, each recess penetrating at least one of the first or second semiconductor structures and the active region,
wherein a cover surface of the active region is a continuous surface,
wherein at least in some of the recesses, surfaces of the recesses are completely covered with an electrically insulating material,
wherein an area fraction in which the active region is penetrated by recesses is at least 10% and at most 20% of an area of the active region, and
wherein the semiconductor body comprises a via completely penetrating the second semiconductor structure and the active region perpendicular to its main extension plane.
12. The optoelectronic semiconductor chip according to claim 11 , wherein the electrically insulating material is a dielectric material.
13. The optoelectronic semiconductor chip according to claim 11 , wherein the active region comprises a plurality of five or more quantum well structures.
14. The optoelectronic semiconductor chip according to claim 11 , wherein the active region is configured to generate electromagnetic radiation with a wavelength longer than 460 nm.
15. The optoelectronic semiconductor chip according to claim 11 , wherein the first or second semiconductor structure, which is completely penetrated by the recesses, is p-conducting.
16. The optoelectronic semiconductor chip according to claim 11 , wherein the recesses partially penetrate into the first or second semiconductor structure, which is not completely penetrated by the recesses.
17. The optoelectronic semiconductor chip according to claim 11 , wherein the active region has at least one second energy level which lies energetically between a first energy level and a third energy level, and wherein the first energy level is the most energetically favorable energy level of a valence band in the active region outside a quantum well structure and the third energy level is the most energetically favorable energy level of quantized hole states in a quantum well structure of the active region.
18. The optoelectronic semiconductor chip according to claim 11 , wherein the active region has at least one further second energy level, which lies energetically between a further first energy level and a further third energy level, and wherein the further first energy level is the most energetically favorable energy level of a conduction band in the active region outside a quantum well structure and the further third energy level is the most energetically favorable energy level of a quantized electron states in a quantum well structure of the active region.