Light emitting device and method for manufacturing light emitting device
A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.
1. A light-emitting device comprising:
a light-emitting semiconductor chip having a light-outcoupling surface; and
an optical element arranged on the light-outcoupling surface,
wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner,
wherein the optical element is mounted on the frame element,
wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and
wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.
2. The light-emitting device according to claim 1 , further comprising a wavelength conversion element arranged on the light-outcoupling surface.
3. The light-emitting device according to claim 2 , wherein the light-emitting semiconductor chip and the wavelength conversion element together are laterally surrounded by the frame element in a form-locking manner.
4. The light-emitting device according to claim 2 , wherein the frame element projects beyond the wavelength conversion element in the vertical direction such that the gas-filled gap between the wavelength conversion element and the optical element is present at least in a partial region.
5. The light-emitting device according to claim 1 , wherein the frame element comprises a reflective material.
6. The light-emitting device according to claim 1 , wherein the frame element comprises a matrix material with particles in the matrix material.
7. The light-emitting device according to claim 1 , wherein the optical element is fixed to the frame element by an adhesive.
8. The light-emitting device according to claim 1 , wherein the optical element has a recess enclosed by an edge in a bottom side.
9. The light-emitting device according to claim 8 , wherein the optical element rests with the edge on the frame element.
10. The light-emitting device according to claim 8 , wherein the optical element is fixed to the frame element by an adhesive between the edge and the frame element.
11. The light-emitting device according to claim 1 , wherein the optical element is a lens element.
12. The light-emitting device according to claim 1 , wherein the gap is air-filled.
13. The light-emitting device according to claim 1 , wherein the light-emitting semiconductor chip is a flip-chip configured to be electrically contacted on a rear side opposite the light-outcoupling surface.
14. The light-emitting device according to claim 13 , wherein the frame element partly covers the rear side.
15. The light-emitting device according to claim 1 , wherein the frame element completely covers all side surfaces of the light-emitting semiconductor chip.