Light-Emitting Device and Method for Manufacturing a Light-Emitting Device

1 . Light-emitting device, comprising:

at least one light-emitting semiconductor body with an active layer configured to generate light;

a housing comprising a carrier and a cover plate which is transparent to the light,

wherein the carrier and the cover plate are connected to each other by a surrounding metal frame and, together with the metal frame, form a hermetically sealed interior space,

wherein the at least one light-emitting semiconductor body is arranged inside the interior space, and

wherein the cover plate is a growth substrate on which the at least one light-emitting semiconductor body is grown.

2 . The device according to claim 1 , wherein the cover plate comprises sapphire.

3 . The device according to claim 1 , wherein the cover plate has a surface structure on a surface facing the at least one light-emitting semiconductor body.

4 . The device according to claim 1 , wherein the metal frame is directly adjacent to the cover plate.

5 . The device according to claim 1 , wherein the metal frame is soldered to the carrier.

6 . The device according to claim 1 , wherein the carrier has at least two through-connections through which the at least one light-emitting semiconductor body is electrically contactable from an outside.

7 . The device according to claim 6 , wherein the at least one light-emitting semiconductor body has at least two electrical contacts on a side remote from the cover plate, and each of the at least two electrical contacts is electrically conductively connected to one of the at least two through-connections, respectively.

8 . The device according to claim 1 , wherein the at least one light-emitting semiconductor body is a flip chip.

9 . The device according to claim 1 , wherein the at least one light-emitting semiconductor body is configured to emit light in a UV-C wavelength range during operation.

10 . The device according to claim 1 , wherein at least two light-emitting semiconductor bodies are arranged in the interior space on the cover plate.

11 . The device according to claim 1 , wherein the light-emitting device is free of organic materials.

12 . A method for manufacturing a light-emitting device, the method comprising:

growing a semiconductor layer sequence in a large-area and in a contiguous fashion on a growth substrate;

structuring the semiconductor layer sequence into separate semiconductor bodies by removing a semiconductor material on the growth substrate;

applying metal frames around the semiconductor bodies, wherein each of the metal frames is applied around at least one of the semiconductor bodies, respectively;

placing a carrier plate over the growth substrate on the metal frames; and

dividing the carrier plate and the growth substrate between the metal frames so as to form a plurality of light-emitting devices.

13 . The method according to claim 12 , further comprising:

completely removing the semiconductor material of the semiconductor layer sequence between the semiconductor bodies from the growth substrate; and

directly applying the metal frames to the growth substrate.

14 . The method according to claim 12 , wherein applying the metal frames around the semiconductor bodies comprises, for each metal frame, applying a frame-shaped basic metallization and applying a metallic reinforcing layer to the basic metallization by an electroplating method.

15 . The method according to claim 12 , wherein the carrier plate is soldered to the metal frames.