Method of producing an optoelectronic component, and optoelectronic component
A method of producing an optoelectronic component includes providing a carrier; securing a sheet including a wavelength-converting material on a top side of the carrier; arranging a grid structure on a top side of the sheet; arranging an optoelectronic semiconductor chip in an opening of the grid structure on the top side of the sheet; arranging a potting material on the top side of the sheet, wherein the grid structure and the optoelectronic semiconductor chip are at least partly embedded into the potting material, and a composite body including the potting material, the sheet, the grid structure and the optoelectronic semiconductor chip is formed; and detaching the composite body from the carrier.
1. An optoelectronic component comprising:
a composite body comprising a molded body,
an optoelectronic semiconductor chip embedded into the molded body,
a grid structure embedded into the molded body, and
a layer of a wavelength-converting material adjoining a front side of the molded body,
wherein the optoelectronic semiconductor chip is arranged in an opening of the grid structure,
a front side of the optoelectronic semiconductor chip and a front side of the grid structure terminate flush with the front side of the molded body, and
a rear side of the optoelectronic semiconductor chip terminates flush with a rear side of the molded body.
2. The optoelectronic component according to claim 1 , wherein a rear side of the grid structure is covered by the molded body.
3. The optoelectronic component according to claim 1 , wherein the front side of the grid structure comprises a structuring.