Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip

1. An optoelectronic semiconductor chip comprising:

a semiconductor layer sequence having an active region that generates radiation, a first semiconductor layer and a second semiconductor layer, the active region being arranged between the first semiconductor layer and the second semiconductor layer;

a first contact and a second contact for external electrical contacting of the semiconductor chip;

a first terminal layer region, via which the first contact electrically conductively connects to the first semiconductor layer;

a second terminal layer region, via which the second contact electrically conductively connects to the second semiconductor layer; and

a first insulation layer and a second insulation layer;

wherein

the first terminal layer region and the second terminal layer region are each arranged in some areas between the first insulation layer and the second insulation layer in a vertical direction perpendicular to a main extension plane of the active region;

the first terminal layer region and the second terminal layer region are arranged side by side without overlapping;

the first terminal layer region extends in places up to a side surface of the semiconductor chip, and

the first terminal layer region completely runs around the active region in a lateral direction.

2. The optoelectronic semiconductor chip according to claim 1 , wherein the first insulation layer and the second insulation layer each comprises a plurality of sublayers and forms a dielectric mirror structure.

3. The optoelectronic semiconductor chip according to claim 1 , wherein the second insulation layer runs around the first terminal layer region in a lateral direction.

4. The optoelectronic semiconductor chip according to claim 1 , wherein the first terminal layer region and the second terminal layer region have the same material composition and the same layer thickness.

5. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor layer sequence is arranged on a substrate, the first contact and the second contact are arranged on a side of the semiconductor layer sequence facing away from the substrate, and radiation generated during operation of the semiconductor chip exits through the substrate.

6. The optoelectronic semiconductor chip according to claim 1 , wherein the first semiconductor layer, the first terminal layer region, and a substrate are flush with the side surface.