Method of operating an optoelectronic component and optoelectronic component
A method of operating an optoelectronic component, including a plurality of picture elements and a plurality of temperature sensors, wherein the picture elements are each configured to emit light, and the temperature sensors thermally conductively connect to the picture elements, the method including acquiring temperature values supplied by the temperature sensors; and controlling the picture elements in dependence on the acquired temperature values.
1. A method of operating an optoelectronic component, comprising a plurality of picture elements that are each configured to emit light, a carrier formed as a semiconductor chip, at least one light-emitting diode chip arranged on an upper side of the carrier, and a plurality of temperature sensors integrated into the carrier and thermally conductively connected to the picture elements, the method comprising:
acquiring temperature values supplied by the temperature sensors; and
controlling the picture elements in dependence on the acquired temperature values.
2. The method according to claim 1 , further comprising interpolating the acquired temperature values to obtain further temperature values.
3. The method according to claim 1 , wherein a supply voltage or a supply current strength is changed in dependence on the acquired temperature values in at least one picture element.
4. The method according to claim 3 , wherein the supply voltage or the supply current is changed so that a wavelength, intensity, light color, and/or color temperature of the light emitted by the picture element approximates a target value.
5. The method according to claim 3 , wherein the supply voltage or the supply current is changed so that a temperature of the picture element decreases.
6. The method according to claim 1 , further comprising logging the acquired temperature values.
7. The method according to claim 6 , further comprising computing a thermal stress incurred over the previous operating life for each picture element from the logged temperature values.
8. The method according to claim 7 , wherein control of the picture elements is carried out in dependence on the computed thermal stress of the respective picture elements.
9. The method according to claim 7 , further comprising computing a remaining service life to be expected for each picture element from the computed thermal stresses.
10. The method according to claim 1 , wherein randomly selected first picture elements of a group of adjacent picture elements are controlled so that they emit light, and remaining picture elements of the group of adjacent picture elements are controlled so that they do not emit light.
11. An optoelectronic component comprising:
a plurality of picture elements, each configured to emit light, and a plurality of temperature sensors thermally conductively connected to the picture elements, wherein the optoelectronic component comprises a carrier, the optoelectronic component comprises at least one light-emitting diode chip arranged on an upper side of the carrier,
the carrier is formed as a semiconductor chip, and
the temperature sensors are integrated into the carrier.
12. The optoelectronic component according to claim 11 , wherein the optoelectronic component comprises a control unit configured to operate the optoelectronic component according to a method comprising:
acquiring temperature values supplied by the temperature sensors; and
controlling the picture elements in dependence on the acquired temperature values.
13. The optoelectronic component according to claim 11 , wherein the light-emitting diode chip connects to the upper side of the carrier by a solder connection, hybrid bond connection, or direct bond connection.
14. The optoelectronic component according to claim 11 , wherein each light-emitting diode chip forms multiple picture elements.
15. The optoelectronic component according to claim 11 , wherein each picture element comprises at least one light-emitting diode chip.
16. The optoelectronic component according to claim 11 , wherein a number of the temperature sensors is less than or equal to the number of the picture elements.
17. The optoelectronic component according to claim 11 , wherein the picture elements are arranged in a two-dimensional matrix arrangement.
18. The optoelectronic component according to claim 11 , wherein the temperature sensors are arranged in a two-dimensional matrix arrangement.
19. The optoelectronic component according to claim 18 , wherein a middle region of the matrix arrangement of picture elements comprises a higher number of temperature sensors per picture element than a peripheral region of the matrix arrangement of picture elements.
20. The optoelectronic component according to claim 11 , wherein the optoelectronic component comprises a plurality of current sources or voltage sources that apply electric current and electric voltage to the picture elements.
21. The optoelectronic component according to claim 11 , wherein the optoelectronic component comprises a plurality of current sources or voltage sources that apply electric current and electric voltage to the picture elements, and the current sources or voltage sources are integrated into the carrier.
22. The optoelectronic component according to claim 11 , wherein the optoelectronic component comprises a storage device that saves acquired temperature values.
23. A method of operating an optoelectronic component, comprising a plurality of picture elements and a plurality of temperature sensors, wherein the picture elements are each configured to emit light, the temperature sensors thermally conductively connect to the picture elements, randomly selected first picture elements of a group of adjacent picture elements are controlled so that they emit light, and remaining picture elements of the group of adjacent picture elements are controlled so that they do not emit light, the method comprising:
acquiring temperature values supplied by the temperature sensors; and
controlling the picture elements in dependence on the acquired temperature values.