Optoelectronic component having an optical element with different inner surface regions

1. An optoelectronic component comprising:

a carrier with a mounting surface on an upper side of the carrier;

an optoelectronic semiconductor chip with a main surface facing away from the carrier;

a housing impermeable to radiation; and

an optical element with an outer surface and an inner surface that faces away from the outer surface,

wherein the optoelectronic semiconductor chip is arranged on the mounting surface of the carrier so as to face the inner surface of the optical element,

wherein the housing partially surrounds the optoelectronic semiconductor chip,

wherein a first surface region of the inner surface is entirely flat and extends from the mounting surface towards the housing transversely to the main surface,

wherein a second surface region of the inner surface extends towards the optoelectronic semiconductor chip, the second surface region directly adjoining the first surface region,

wherein a third surface region of the inner surface extends from the second surface region towards the housing, and

wherein the second surface region and the third surface region are TIR (Total Internal Reflection) reflectors.

2. The optoelectronic component according to claim 1 , wherein the optical element in the first surface region is configured to direct electromagnetic radiation towards the second surface region.

3. The optoelectronic component according to claim 1 , wherein the optical element in the second surface region is configured to direct electromagnetic radiation towards the third surface region.

4. The optoelectronic component according to claim 1 , wherein the second surface region is arranged directly above the optoelectronic semiconductor chip.

5. The optoelectronic component according to claim 1 , wherein the third surface region is arranged directly above the optoelectronic semiconductor chip.

6. The optoelectronic component according to claim 1 , wherein the optical element adjoins the mounting surface in the first surface region.

7. The optoelectronic component according to claim 1 , wherein no region of the housing is arranged on at least one side surface of the optoelectronic semiconductor chip.

8. The optoelectronic component according to claim 1 , further comprising an additional optical element arranged between the third surface region and the housing.

9. The optoelectronic component according to claim 8 , wherein the additional optical element is configured to change a direction of electromagnetic radiation.

10. The optoelectronic component according to claim 1 , wherein the optoelectronic component is configured to detect electromagnetic radiation from a first half space and not to detect electromagnetic radiation from a second half-space.

11. The optoelectronic component according to claim 1 , wherein the optoelectronic component is configured to emit electromagnetic radiation into a first half-space and not to emit electromagnetic radiation into a second half-space.

12. An optoelectronic assembly comprising:

the optoelectronic component according to claim 1 ; and

a detector comprising a detector chip,

wherein the optoelectronic component is configured to emit electromagnetic radiation into a first half-space and not to emit electromagnetic radiation into a second half-space,

wherein the detector chip is configured to detect electromagnetic radiation, and

wherein the optoelectronic semiconductor chip and the detector chip are separated from each other by a part of the housing.

13. The optoelectronic assembly according to claim 12 , wherein the optoelectronic component comprises two or more optoelectronic components.

14. The optoelectronic assembly according to claim 13 , wherein the detector is arranged between two of the optoelectronic components.

15. An optoelectronic component comprising:

a carrier with a mounting surface on an upper side of the carrier;

an optoelectronic semiconductor chip with a main surface facing away from the carrier;

a housing impermeable to radiation; and

an optical element with an outer surface and an inner surface that faces away from the outer surface,

wherein the optoelectronic semiconductor chip is arranged on the mounting surface of the carrier so as to face the inner surface of the optical element,

wherein the housing partially surrounds the optoelectronic semiconductor chip,

wherein a first surface region of the inner surface is entirely flat and extends from the mounting surface towards the housing transversely to the main surface,

wherein a second surface region of the inner surface extends towards the optoelectronic semiconductor chip, the second surface region directly adjoining the first surface region,

wherein a third surface region of the inner surface extends from the second surface region towards the housing,

wherein the optical element is a radiation-directing optical element, and

wherein the second surface region and the third surface region are TIR (Total Internal Reflection) reflectors.

16. The optoelectronic component according to claim 15 , wherein the optical element in the first surface region is configured to direct electromagnetic radiation towards the second surface region, and wherein the optical element in the second surface region is configured to direct electromagnetic radiation towards the third surface region.

17. The optoelectronic component according to claim 15 , wherein the second surface region is arranged directly above the optoelectronic semiconductor chip.

18. The optoelectronic component according to claim 15 , wherein the third surface region is arranged directly above the optoelectronic semiconductor chip.

19. The optoelectronic component according to claim 15 , wherein the optical element adjoins the mounting surface in the first surface region.