Method for establishing electrical contact of a semiconductor layer and semiconductor component having electrical contact
A method for producing an electrical contact on a semiconductor layer and a semiconductor component having an electrical contact are disclosed. In an embodiment a method includes providing a semiconductor layer, forming a plurality of contact rods on the semiconductor layer, wherein the contact rods are formed by a first material and a second material, wherein the first material is applied to the semiconductor layer and the second material is applied to the first material, and wherein a lateral structure of the first material is self-organized, forming a filling layer on the contact rods and in intermediate spaces between the contact rods and exposing the contact rods.
1. A method for producing an electrical contact on a semiconductor layer, the method comprising:
providing the semiconductor layer;
forming a plurality of contact rods on the semiconductor layer, wherein the contact rods are formed by a first material and a second material, wherein the first material is applied to the semiconductor layer and the second material is applied to the first material, and wherein a lateral structure of the first material is self-organized;
forming a filling layer on the contact rods and in intermediate spaces between the contact rods; and
exposing the contact rods.
2. The method according to claim 1 , further comprising applying an intermediate layer to the semiconductor layer prior to forming the plurality of contact rods, wherein the contact rods are applied to the intermediate layer.
3. The method according to claim 1 , further comprising applying a contact layer to the contact rods so that at least some of the exposed contact rods are electrically conductively connected to one another.
4. The method according to claim 1 , wherein the first material is structured according to a given lateral structure.
5. The method according to claim 1 , wherein forming the first material comprises applying the first material in clusters and reducing a lateral extension of the clusters before the second material is formed, so that the clusters are laterally spaced apart from one another at least in places.
6. The method according to claim 1 , wherein forming the second material comprises applying the second material by electrodeposition.
7. The method according to claim 1 , wherein forming the second material comprises performing crystal growth proceeding from the first material.
8. The method according to claim 1 , wherein the filling layer comprises a dielectric material.
9. The method according to claim 1 , wherein the filling layer contains a TCO material.
10. The method according to claim 1 , wherein the filling layer comprises a first sublayer and a second sublayer, and wherein the first sublayer comprises a dielectric material and the second sublayer comprises a TCO material.
11. A semiconductor component produced by the method according to claim 1 .
12. A semiconductor component comprising:
an electrical contact arranged on a semiconductor layer,
wherein the contact comprises a plurality of contact rods,
wherein intermediate spaces between the contact rods are filled with a filler material,
wherein the contact rods are electrically conductively connected to one another on a side facing away from the semiconductor layer via a contact layer, and
wherein the contact rods have a density of at least 1,000,000 pieces per mm 2 at least in places.
13. The semiconductor component according to claim 12 , wherein the contact rods are not arranged regularly in lateral direction.
14. The semiconductor component according to claim 12 , wherein distances between neighboring contact rods differ from one another.
15. The method according to claim 1 , wherein the second material grows between the first material and the semiconductor layer.
16. A method for producing an electrical contact on a semiconductor layer, the method comprising:
providing the semiconductor layer;
forming a plurality of contact rods on the semiconductor layer, wherein the contact rods are formed by a first material and a second material, wherein the first material is applied to the semiconductor layer and the second material is applied to the first material, wherein the second material grows between the first material and the semiconductor layer, and wherein a lateral structure of the first material is self-organized;
forming a filling layer on the contact rods and in intermediate spaces between the contact rods; and
exposing the contact rods.